5SGXEABK2H40I3G

The 5SGXEABK2H40I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1517-BBGA FCBGA package with a 1517-HBGA (45×45) supplier package footprint. It provides very-high logic density and on-chip memory capacity for complex, programmable designs.

Key hardware characteristics include 952,000 logic elements, approximately 53 Mbits of embedded memory, and up to 696 user I/Os, making this device suitable for demanding industrial and high-density system designs that require extensive programmable logic and I/O integration.

Key Features

• High Logic Density — 952,000 logic elements to implement large-scale digital designs and complex algorithms.
• On-Chip Memory — Approximately 53 Mbits of embedded RAM for buffering, state storage, and algorithm working memory.
• Extensive I/O — Up to 696 I/O pins to support broad interfacing needs across peripherals, boards, and mezzanines.
• Power Core Range — Core supply voltage specified from 820 mV to 880 mV to match system power-rail requirements.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for robust deployment in industrial environments.
• Package & Mounting — 1517-BBGA FCBGA package, surface-mount mounting type, supplier device package 1517-HBGA (45×45) for high-density board designs.
• Standards Compliance — RoHS compliant to support regulatory material requirements.
• Stratix V GX Family Characteristics — Series-level documentation for Stratix V GX devices describes multiple transceiver and speed-grade offerings for high-performance serial connectivity (see device datasheet for family-level electrical and transceiver characteristics).

Typical Applications

• High-density digital processing — Implement large-scale state machines, datapath pipelines, and custom acceleration logic using extensive logic elements and embedded RAM.
• Network and communications equipment — Leverage the Stratix V GX family transceiver capabilities and high I/O count for packet processing, switching, and protocol bridging (refer to family datasheet for transceiver specifications).
• Industrial control systems — Use the industrial temperature rating and broad I/O to integrate control logic, sensor interfaces, and deterministic processing in harsh environments.
• Data plane and acceleration — Deploy FPGA-based offload or preprocessing functions where on-chip memory and large logic capacity accelerate throughput and reduce system latency.

Unique Advantages

• Massive programmable fabric: 952,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant embedded memory: Approximately 53 Mbits of RAM supports large buffers, look-up tables, and state retention without external memory dependency.
• Broad I/O connectivity: 696 I/O pins provide flexible interfacing options to peripherals, mezzanines, and high-speed boards.
• Industrial-grade operation: –40 °C to 100 °C operating range allows reliable deployment in industrial environments.
• Compact, surface-mount packaging: 1517-BBGA/1517-HBGA package supports high-density PCB designs while maintaining a standardized footprint.
• Regulatory material compliance: RoHS compliance helps simplify regulatory considerations for manufactured products.

Why Choose 5SGXEABK2H40I3G?

The 5SGXEABK2H40I3G combines very-high logic density, substantial embedded RAM capacity, and a large I/O complement in a robust industrial-grade FPGA package. This combination makes it well suited for designers who need to implement large, integrated digital systems on a single programmable device while meeting industrial temperature requirements.

Backed by Stratix V GX family documentation and Intel design support resources, this device offers a scalable platform for complex logic designs, high-throughput data processing, and dense I/O integration, delivering long-term value through integration and flexibility.

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