5SGXEABK2H40I2LN

The 5SGXEABK2H40I2LN is a Stratix V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package optimized for high-density logic and large embedded memory requirements. With 952,000 logic elements and approximately 53.25 Mbits of on-chip RAM, this industrial-grade device targets designs that require substantial programmable logic, extensive I/O, and low-voltage core operation.

Key Features

• Core Logic  952,000 logic elements provide very high logic density for complex FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of embedded RAM for large on-chip buffering and state storage.
• I/O Density  696 user I/O pins to support wide parallel interfaces and multiple off-chip connections.
• Core Voltage  Low-voltage core supply range of 0.820 V to 0.880 V to match system power-rail constraints.
• Package & Mounting  Available in a 1517-BBGA FCBGA package; supplier device package listed as 1517-HBGA (45 × 45). Surface-mount mounting simplifies assembly for modern PCBs.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C for reliability in demanding environments.
• Standards Compliance  RoHS compliant to meet current environmental and manufacturing requirements.

Typical Applications

• High-density logic integration  Use where a large number of programmable logic elements are required to implement complex digital systems on a single device.
• On-chip buffering and memory-heavy designs  Large embedded RAM enables substantial on-chip data storage for packet buffering, frame storage, or algorithm state.
• High I/O-count systems  The 696 I/Os support extensive parallel interfaces, mezzanine connections, and multi-channel I/O requirements.

Unique Advantages

• High logic capacity: 952,000 logic elements reduce the need for multi-FPGA partitioning, simplifying system architecture.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffers and complex state machines without external memory.
• Extensive connectivity: 696 I/Os provide flexibility to interface with a broad set of peripherals and external devices.
• Industrial-grade thermal range: –40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact FCBGA packaging: 1517-BBGA / 1517-HBGA (45 × 45) packaging balances density and manufacturability for surface-mount assembly.
• Low-voltage core operation: 0.82–0.88 V supply allows integration with modern low-voltage power domains.

Why Choose 5SGXEABK2H40I2LN?

This Stratix V GX FPGA delivers a combination of very high logic density, substantial embedded memory, and broad I/O capacity in an industrial-grade, surface-mount package. It is suitable for designs that demand large programmable resources and robust operation across a wide temperature range. The device’s specification suite — including core voltage range, large on-chip RAM, and high I/O count — supports scalable, reliable FPGA-based implementations while aligning with manufacturing and environmental standards.

Request a quote or contact sales to discuss availability, lead times, and pricing for the 5SGXEABK2H40I2LN. Our team can provide additional ordering and technical support information to help integrate this Stratix V GX device into your design.