5SGXEABK2H40C2LN

The 5SGXEABK2H40C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density, high-I/O applications. It combines a large logic fabric with substantial on-chip memory and a broad I/O count in a 1517-BBGA (FCBGA) surface-mount package.

This device is targeted at designs that require significant programmable logic capacity and embedded memory while operating within commercial temperature and supply ranges. The device is documented in the Stratix V device datasheet for electrical and switching characteristics.

Key Features

• Core & Logic Capacity — 952,000 logic elements to support complex digital functions and large-scale FPGA implementations.
• Logic Blocks — 359,200 logic blocks to map wide logic structures and hierarchical designs.
• Embedded Memory — Approximately 53.25 Mbits of embedded RAM for buffering, lookup tables, and on-chip data storage.
• I/O Resources — 696 user I/Os to enable expansive external interfacing and wide parallel buses.
• Package & Mounting — 1517-BBGA (FCBGA) surface-mount package; supplier device package listed as 1517-HBGA (45×45).
• Power Supply — Core supply range specified at 820 mV to 880 mV to support the device’s core operating point.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operating temperature.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Use the 952,000 logic elements and large embedded RAM to implement compute-intensive algorithms and custom accelerators.
• Multi‑interface systems — The 696 I/O pins enable wide parallel buses, protocol bridging, and multi-channel connectivity in complex systems.
• System prototyping and emulation — Large logic and memory resources make this device suitable for hardware validation and FPGA-based prototyping of large designs.

Unique Advantages

• Significant programmable capacity: 952,000 logic elements provide the headroom needed for large, integrated FPGA designs.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces dependency on external memory for many buffering and state-storage tasks.
• Extensive I/O count: 696 I/Os give flexibility for broad interface requirements without complex external multiplexing.
• Compact high-pin package: The 1517-BBGA (FCBGA) package delivers high interconnect density in a surface-mount footprint compatible with modern PCB assembly.
• Commercial operating range: Rated for 0 °C to 85 °C to match standard commercial product requirements.
• RoHS compliant: Facilitates deployment in environments and supply chains that require RoHS conformance.

Why Choose 5SGXEABK2H40C2LN?

The 5SGXEABK2H40C2LN positions itself as a high-capacity Stratix V GX FPGA option for designers needing extensive programmable logic, large embedded RAM, and a high I/O count in a compact BGA package. Its documented electrical and switching characteristics in the Stratix V datasheet support informed engineering decisions for commercial-grade designs.

This device is suited to teams implementing large-scale FPGA-based systems, hardware prototyping, and applications where on-chip resources reduce external component count and simplify system architecture while remaining within commercial temperature and voltage ranges.

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