5SGXEABK2H40C2N

The 5SGXEABK2H40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density, I/O-rich designs. This commercial-grade device delivers large programmable logic capacity and substantial on-chip memory for complex system integration.

As a member of the Stratix V GX family, the device is part of a platform that includes high-speed transceiver options and a range of performance grades. Key value comes from a combination of very high logic element count, extensive I/O, and significant embedded memory, all in a surface-mount FCBGA package.

Key Features

• Core logic capacity — 952,000 logic elements (logic cells) to support large-scale FPGA implementations and complex digital designs.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM (53,248,000 total RAM bits) for buffering, data storage, and memory-intensive algorithms.
• High I/O count — 696 I/O pins to accommodate dense board-level connectivity and multiple peripheral interfaces.
• Package and mounting — Available in a 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for standard PCB assembly.
• Power requirements — Device voltage supply range specified at 870 mV to 930 mV, enabling integration into low-voltage power architectures.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C, suitable for mainstream commercial applications.
• RoHS compliant — Meets RoHS environmental requirements for lead-free designs.

Typical Applications

• High-density digital processing — Large logic capacity supports complex FPGA-based processing engines and custom silicon replacements.
• I/O-intensive systems — 696 I/Os enable designs that require extensive sensor, interface, or peripheral connectivity.
• Memory-dependent functions — Approximately 53.25 Mbits of embedded RAM for packet buffering, on-chip data staging, or algorithmic state storage.
• Commercial embedded systems — Commercial temperature rating and surface-mount package fit mainstream electronics and board-level integration.

Unique Advantages

• Highly integrated logic and memory: 952,000 logic elements combined with ~53.25 Mbits of on-chip RAM reduce external memory and logic partitioning needs.
• Extensive board connectivity: 696 I/Os simplify routing of multiple interfaces and reduce the need for external multiplexing.
• Compact FCBGA package: 1517-BBGA / 1517-HBGA (45×45) packaging delivers high density in a surface-mount form factor for space-constrained PCBs.
• Low-voltage core operation: 870 mV–930 mV supply allows integration with modern low-voltage power domains.
• Commercial operating range: 0 °C–85 °C supports standard commercial product deployments and development platforms.
• RoHS compliance: Facilitates regulatory and manufacturing requirements for lead-free product lines.

Why Choose 5SGXEABK2H40C2N?

The 5SGXEABK2H40C2N positions itself for demanding commercial designs that require very high logic density, substantial embedded memory, and broad I/O capability in a compact surface-mount package. Its placement in the Stratix V GX family aligns it with devices that include high-speed transceiver options and multiple performance grades.

For engineering teams building complex FPGA-based systems—where integration, on-chip memory, and large I/O counts reduce board-level complexity—this device provides a scalable, RoHS-compliant solution with defined commercial temperature and voltage requirements to support predictable system design and deployment.

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