5SGXEA9N3F45I3L

The 5SGXEA9N3F45I3L is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package. It provides 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 user I/Os, delivered in a surface-mount 1932-FBGA, FC (45×45) package.

Offered in an industrial temperature grade with an operating range of −40 °C to 100 °C and a core supply window of 820 mV to 880 mV, the device targets designs that require high logic capacity, substantial on-chip RAM, and large I/O counts. Series-level datasheet details for Stratix V GX devices also document support for high-speed transceiver speed grades.

Key Features

• Core Density — 840,000 logic elements to implement large-scale FPGA designs and complex custom logic.
• Embedded Memory — Approximately 53.25 Mbits of total on-chip RAM for buffering, packet storage, and deep internal data structures.
• I/O Capacity — 840 user I/Os to support dense external interfaces and multiple simultaneous device connections.
• Transceiver Capability (series) — Stratix V GX devices include transceiver speed grades documented in the datasheet, including channel speeds up to 14.1 Gbps at the series level.
• Power and Voltage — Core supply range of 820 mV to 880 mV to match platform power-plane design requirements.
• Package & Mounting — 1932-BBGA (supplier package: 1932-FBGA, FC, 45×45) in a surface-mount FCBGA format for compact board integration.
• Industrial Operating Range — Rated for −40 °C to 100 °C operating temperature and specified as an industrial grade device.
• Regulatory — RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• High-speed serial links — Leverage Stratix V GX transceiver speed grades (series-level) to implement multi-gigabit serial interfaces and optical/electrical link endpoints.
• Complex logic and signal processing — Use the 840,000 logic elements and ~53.25 Mbits of embedded RAM to implement compute-intensive custom accelerators, DSP pipelines, and packet processing engines.
• Dense I/O aggregation — 840 I/Os enable aggregation of many peripherals, multi-lane interfaces, or high-channel-count sensor and switch matrices.

Unique Advantages

• High logic integration: 840,000 logic elements provide the capacity for large, unified FPGA designs and reduce the need for multiple devices.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory supports deep buffering and on-chip data structures, minimizing external memory dependence.
• Large I/O footprint: 840 I/Os allow flexible partitioning of interfaces and support for complex multi-protocol designs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments where wider temperature tolerance is required.
• Compact, manufacturable package: 1932-FBGA (45×45) surface-mount package simplifies high-density PCB integration and assembly.
• Controlled core voltage window: 820–880 mV supply range aids predictable power design and thermal planning.

Why Choose 5SGXEA9N3F45I3L?

The 5SGXEA9N3F45I3L combines very high logic density, substantial embedded RAM, and a large I/O complement in a single industrial-grade Stratix V GX FPGA package. These attributes make it suitable for designs that require consolidated FPGA resources, high on-chip buffering, and extensive external connectivity within a controlled power and thermal envelope.

For engineers and procurement teams building systems that need scalable programmable logic alongside high-speed serial capability (as documented for the Stratix V GX series), the 5SGXEA9N3F45I3L delivers a balance of integration, package density, and industrial operating range backed by the Stratix V device family specifications.

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