5SGXEA9N3F45C4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 154 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEA9N3F45C4G – Stratix V GX FPGA, 840,000 logic elements, approximately 53 Mbits RAM, 840 I/Os, 1932-BBGA
The 5SGXEA9N3F45C4G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package. It delivers very high logic capacity, extensive on-chip RAM, and a large I/O count for demanding programmable-logic applications.
Built for commercial-grade systems, this device supports designs that require substantial programmable logic resources, high I/O density, and integrated embedded memory while operating within a specified core voltage range.
Key Features
- Core Logic 840,000 logic elements provide large-scale programmable logic capacity for complex digital designs.
- Embedded Memory Approximately 53 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
- I/O Density 840 user I/Os enable extensive external connectivity and high pin-count interfaces.
- Power and Voltage Specified core supply voltage range of 820 mV to 880 mV to match system power-rail requirements.
- Package & Mounting 1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45), and surface-mount mounting for standard PCB assembly.
- Temperature Grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Standards Compliance RoHS compliant.
- Family-Level Technical Reference Stratix V device documentation describes electrical and switching characteristics for the family, including transceiver and core/periphery performance and I/O timing details.
Typical Applications
- High-density programmable logic systems — Deploy where large numbers of logic elements and on-chip RAM are required for complex algorithms and state machines.
- High I/O interface designs — Use the device in systems that need many external connections or multi-channel front-end interfaces.
- Embedded memory–intensive functions — Suitable for designs that require significant on-chip buffering, lookup tables, or packet memory using the device’s embedded RAM.
Unique Advantages
- High logic capacity: 840,000 logic elements enable implementation of large, complex designs without immediate partitioning across multiple devices.
- Substantial on-chip RAM: Approximately 53 Mbits of embedded memory reduce external memory dependency and simplify board-level design.
- Extensive I/O: 840 I/Os allow flexible interfacing with multiple peripherals, transceivers, and high-pin-count connectors.
- Compact high-pin-count package: 1932-BBGA FCBGA provides the pin density required for high-performance designs while supporting surface-mount assembly.
- Commercial-temperature operation: Rated for 0 °C to 85 °C environments to match mainstream commercial electronic systems.
- Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.
Why Choose 5SGXEA9N3F45C4G?
The 5SGXEA9N3F45C4G sits within the Stratix V GX family to deliver a balance of very high logic density, significant embedded memory, and broad I/O capability in a single commercial-grade FPGA package. Its defined voltage range and package details make it suitable for system designs that require predictable power and assembly characteristics.
This device is well suited to teams and projects that need to consolidate complex programmable-logic functions into a single FPGA, reduce external memory requirements, and implement high-pin-count interfaces while maintaining compliance with RoHS requirements and commercial temperature operation.
Request a quote or submit a sales inquiry to receive pricing, availability, and technical support information for part number 5SGXEA9N3F45C4G.

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