5SGXEA9N3F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 756 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9N3F45C2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

The 5SGXEA9N3F45C2LN is a Stratix V GX series Field Programmable Gate Array (FPGA) from Intel, offered in a commercial temperature grade. It combines very high logic capacity with substantial embedded memory and a large I/O count to support complex, integration‑heavy designs.

This device is built on the Stratix V GX architecture (series-level), providing the density and I/O resources required for advanced FPGA implementations while operating within a commercial voltage and temperature envelope.

Key Features

  • Core logic capacity 840,000 logic elements for large-scale logic integration and complex design implementation.
  • Embedded memory Approximately 53.25 Mbits of on‑chip RAM to support buffers, FIFOs, and distributed memory structures.
  • I/O resources 840 general-purpose I/Os to support dense system interfacing and routing.
  • Power supply Core voltage range specified at 820 mV to 880 mV.
  • Package and mounting 1932‑BBGA FCBGA package (supplier device package: 1932‑FBGA, FC (45×45)), surface-mount design for high‑density board layouts.
  • Temperature and grade Commercial grade device rated for 0°C to 85°C operating temperature.
  • Series transceiver capability (series-level) Stratix V GX devices in the family support GX transceiver speed grades (as documented in the Stratix V device datasheet).
  • Regulatory compliance RoHS compliant.

Unique Advantages

  • High integration density: 840,000 logic elements and ~53.25 Mbits of embedded memory reduce external component needs and simplify complex system architectures.
  • Large I/O complement: 840 I/Os enable broad peripheral connectivity and high pin-count interfaces without external multiplexing.
  • Compact BGA footprint: 1932‑ball FCBGA (45×45) package delivers high pin density in a board-friendly surface-mount form factor.
  • Commercial design suitability: Specified for 0°C to 85°C operation and commercial grade use cases where this temperature and grade meet system requirements.
  • Standards-conscious supply: RoHS compliance supports systems requiring lead‑free manufacturing processes.
  • Documented architecture: Backed by the Stratix V device datasheet for electrical characteristics and series-level transceiver information.

Why Choose 5SGXEA9N3F45C2LN?

The 5SGXEA9N3F45C2LN offers a combination of very high logic density, substantial embedded memory, and extensive I/O count in a compact FCBGA package—making it suitable for commercial designs that demand on‑chip resources and integration. As a member of the Stratix V GX family, it inherits the documented electrical characteristics and series-level transceiver capabilities described in the Stratix V device documentation.

This part is well suited to development teams and procurement groups targeting dense, integration-focused FPGA implementations within commercial temperature ranges, where verified device specifications and RoHS compliance are required.

Request a quote or submit a request for pricing and availability for part number 5SGXEA9N3F45C2LN.

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