5SGXEA9N3F45C2G

The 5SGXEA9N3F45C2G is a high-density Stratix V GX FPGA in a 1932-ball FCBGA package, optimized for demanding programmable-logic applications. As a member of the Stratix V GX family, the device provides large logic capacity, substantial on-chip memory, and abundant I/O for complex digital designs.

Designed for commercial-grade systems, this FPGA targets applications that require high logic density, extensive embedded memory, and high pin count in a surface-mount FCBGA package.

Key Features

• Logic Capacity  Provides 840,000 logic elements to implement large-scale digital designs and complex system logic.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, frame storage, and data-path designs.
• I/O Density  840 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Package  Surface-mount 1932-BBGA (FCBGA) with a 45×45 mm supplier device package footprint for high-pin-count, compact board layouts.
• Power  Core supply voltage range of 870 mV to 930 mV suitable for Stratix V GX core operation modes.
• Temperature Grade  Commercial operating range from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.
• Series-level High-speed Transceiver Support  Stratix V GX devices feature high-speed transceivers as documented for the series (see datasheet for supported transceiver speed grades and configurations).

Typical Applications

• High-speed communications  Large logic capacity and series-level high-speed transceivers make the device suitable for multi-channel backplane and networking functions.
• Data processing and acceleration  Substantial on-chip RAM and high logic density support custom accelerators, packet processing, and throughput-intensive pipelines.
• Advanced digital systems  High I/O count and dense logic enable implementation of complex controllers, interface bridging, and system-level integration.
• Prototyping and platform development  The combination of logic, memory, and I/O resources supports system prototyping and evaluation of large designs on a single device.

Unique Advantages

• High logic integration: 840,000 logic elements reduce the need for multi-device partitioning and simplify system architecture.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM provides ample capacity for buffers, FIFOs, and data-path storage.
• Extensive I/O capability: 840 I/O pins allow dense parallel interfacing and flexible I/O allocation for complex systems.
• Compact, high-pin-count package: 1932-ball FCBGA in a 45×45 mm footprint supports high-density board designs while keeping component count low.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial production environments.
• Series-level transceiver options: Stratix V GX family documentation describes high-speed transceiver capabilities for designs that require serial connectivity (refer to the datasheet for details).

Why Choose 5SGXEA9N3F45C2G?

The 5SGXEA9N3F45C2G combines very high logic density, significant embedded memory, and a large number of I/Os in a single commercial-grade FCBGA package—making it a practical choice for designers implementing complex, high-performance digital systems. Its package and power characteristics support compact, high-pin-count board layouts while maintaining the power envelope expected of Stratix V GX core operation.

This device is well suited for teams developing high-throughput communications equipment, data-path accelerators, or system prototypes that require scalable logic resources and series-level high-speed transceiver capability as described in the Stratix V GX documentation.

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