5SGXEA9N2F45I3LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,458 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEA9N2F45I3LN – Stratix V GX FPGA, 840K logic elements, 1932-BBGA
The 5SGXEA9N2F45I3LN is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. This high-density FPGA integrates approximately 840,000 logic elements, roughly 53.25 Mbits of embedded memory, and up to 840 user I/Os in a high-pin-count 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45).
Designed for complex digital designs that demand large logic capacity, extensive on-chip RAM and broad I/O connectivity, this device targets industrial and embedded applications that require robust temperature range and RoHS compliance while operating from a low-voltage core supply.
Key Features
- Core & Logic — Approximately 840,000 logic elements provide substantial programmable logic resources for large-scale digital designs and complex algorithm implementation.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, state machines and data-path storage without external memory for many use cases.
- I/O Density — Up to 840 user I/Os to interface with high-channel-count systems, peripherals and mezzanine or daughter-card connections.
- Package & Mounting — 1932-BBGA FCBGA package (supplier: 1932-FBGA, FC 45×45) in a surface-mount format suitable for automated assembly and compact board layouts.
- Power & Voltage — Core supply range of 820 mV to 880 mV enables low-voltage operation consistent with the Stratix V family electrical characteristics.
- Temperature & Grade — Industrial grade with an operating range of −40 °C to 100 °C for deployment in thermally demanding environments.
- Compliance — RoHS compliant to meet regulatory and assembly requirements for lead-free production.
- Family Documentation — Part of the Stratix V GX family; family datasheet information covers electrical characteristics, operating conditions and speed-grade offerings for Stratix V devices.
Typical Applications
- High-density signal processing — Leverage the large logic and embedded memory resources to implement complex DSP pipelines, packet processing or custom compute kernels.
- Communications and protocol bridging — Use the high I/O count and Stratix V GX family capabilities to implement multi-channel interface conversion, aggregation or protocol handling.
- Industrial control and automation — Industrial temperature rating and broad I/O enable motor control, real-time control logic and sensor aggregation in harsh environments.
- Prototyping and complex SOC integration — High logic capacity and on-chip RAM support integration of custom accelerators and glue logic for advanced prototypes and production SOCs.
Unique Advantages
- Substantial programmable capacity: Approximately 840,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
- Large embedded memory footprint: Approximately 53.25 Mbits of on-chip RAM lowers dependence on external memory for many buffering and state storage needs.
- High I/O count: 840 I/Os support wide parallel interfaces and dense connectivity without added interface chips.
- Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in industrial and embedded deployments.
- Compact, assembly-ready package: 1932-BBGA/1932-FBGA (45×45) surface-mount package streamlines PCB layout for high-pin-count designs.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing and regulatory conformity.
Why Choose 5SGXEA9N2F45I3LN?
The 5SGXEA9N2F45I3LN positions itself as a high-capacity, industrial-grade FPGA within the Stratix V GX family, combining a large pool of logic elements, significant embedded RAM and expansive I/O to address demanding digital design challenges. Its low-voltage core operation and surface-mount BGA package enable efficient board-level integration for compact, high-performance systems.
This device is well suited to engineers and teams building sophisticated signal processing, communications, and industrial control solutions that require scalability, robust operating temperature range and adherence to RoHS requirements. The device’s placement in the Stratix V GX family is supported by family-level documentation covering electrical and switching characteristics and speed-grade options.
Request a quote or submit your pricing and availability inquiry to move your design forward with the 5SGXEA9N2F45I3LN Stratix V GX FPGA.

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