5SGXEA9N2F45I3LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 748 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9N2F45I3LG – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXEA9N2F45I3LG is a Stratix V GX series Field Programmable Gate Array (FPGA) IC designed for demanding industrial embedded and communications applications. It combines high logic density, substantial on-chip memory, and a large I/O complement in a high-pin-count FCBGA package to support complex system integration and high-throughput designs.

Its feature set targets use cases that require large programmable fabric, extensive I/O, and robust operation across an industrial temperature range — providing designers with a compact, high-capacity programmable platform for compute acceleration, signal processing, and high-speed interfacing.

Key Features

  • High Logic Density — 840,000 logic elements (cells) to implement large-scale digital designs and complex algorithms on a single device.
  • Embedded Memory — Approximately 53.2 Mbits of total on-chip RAM for buffering, frame storage, and algorithm state without relying on external memory.
  • Large I/O Count — 840 I/O pins to support extensive peripheral connectivity and parallel interfaces directly from the FPGA.
  • Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C to meet thermal requirements in industrial deployments.
  • Power Supply Range — Core voltage supply specified from 820 mV to 880 mV for precise core power delivery and planning.
  • Package and Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting type for high-density PCB assembly.
  • RoHS Compliant — Device meets RoHS environmental requirements for lead-free assembly and regulatory compliance.
  • Stratix V GX Family Capabilities — Series-level transceiver and speed-grade information is documented for Stratix V GX devices in the product datasheet, providing guidance on transceiver performance options within the family.

Typical Applications

  • Telecommunications & Networking — High logic density and large I/O support packet processing, protocol offload, and interface bridging in network equipment.
  • Data Center & Compute Acceleration — Substantial on-chip RAM and dense logic resources enable hardware acceleration for compute-intensive workloads and data-path offloads.
  • Signal and Video Processing — Embedded memory and abundant logic elements make the device suitable for real-time DSP, video pipeline processing, and multi-channel data aggregation.
  • Industrial Control Systems — Industrial temperature rating and robust I/O counts support motor control, PLC interfaces, and real-time automation tasks.

Unique Advantages

  • Consolidated System Integration: High logic and memory capacity reduce the need for multiple devices, simplifying board-level design and lowering BOM complexity.
  • Flexible I/O Connectivity: 840 I/O pins provide extensive direct interfacing options for sensors, high-speed links, and peripheral buses.
  • Industrial Reliability: Specified –40 °C to 100 °C operation and surface-mount FCBGA packaging provide a stable platform for deployed industrial electronics.
  • Predictable Power Domain: Defined core voltage range (820 mV–880 mV) assists in power-supply design and thermal planning for high-density implementations.
  • Regulatory-Friendly: RoHS compliance supports modern assembly workflows and environmental requirements.

Why Choose 5SGXEA9N2F45I3LG?

The 5SGXEA9N2F45I3LG positions itself as a high-capacity, industrial-grade Stratix V GX FPGA option for designers who need substantial programmable fabric, on-chip memory, and a wide I/O footprint in a single FCBGA package. Its specification set is tailored to complex embedded, networking, and signal-processing applications where integration density and reliable operation across temperature extremes matter.

For development teams and procurement groups targeting scalable, high-performance FPGA solutions, this device offers a balanced combination of logic resources, embedded memory, and I/O that supports long-term platform development and system-level consolidation.

Request a quote or submit a quote for 5SGXEA9N2F45I3LG to receive pricing and availability information tailored to your project needs.

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