5SGXEA9N2F45I2LN

The 5SGXEA9N2F45I2LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offering very large on-chip logic and memory resources in a high-pin-count FCBGA package. It provides 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 user I/Os, making it suitable for designs that require high logic density, substantial embedded RAM, and extensive I/O connectivity.

This device is offered in an industrial temperature grade with a rated operating range of −40 °C to 100 °C, and a core supply voltage window of 820 mV to 880 mV. The device ships in a 1932-BBGA (1932-FBGA, FC 45×45) surface-mount package and is RoHS-compliant.

Key Features

• Core & Logic  840,000 logic elements for large, complex digital designs and high-density implementation.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support sizable data buffering, lookup tables, and state storage.
• I/O Capacity  840 user I/Os to support broad connectivity and parallel interfacing with external systems.
• Package & Mounting  1932-BBGA (1932-FBGA, FC 45×45) surface-mount package for high pin-count board integration.
• Power  Core voltage supply range of 820 mV to 880 mV to align with specified power delivery and core requirements.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS-compliant to meet environmental material requirements.
• Documentation  Supported by the Stratix V device family datasheet covering electrical and switching characteristics, I/O timing, and transceiver descriptions.

Typical Applications

• High-density digital processing  Large logic element count and significant embedded RAM support compute-intensive, custom digital pipelines and accelerators.
• Telecom and networking infrastructure  Extensive I/O and family-level transceiver capability documentation make the device suitable for complex packet-processing and aggregation tasks.
• Industrial systems  Industrial temperature rating (−40 °C to 100 °C) aligns with embedded control and automation environments requiring robust thermal tolerance.
• Prototype and advanced system integration  High I/O count and dense logic enable integration of multiple functions onto a single device for system consolidation.

Unique Advantages

• High logic density: 840,000 logic elements provide the capacity to implement large, complex designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependencies and simplifies board-level memory architecture.
• Extensive I/O resources: 840 user I/Os support broad peripheral and high-throughput interface requirements.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in thermally demanding embedded and industrial environments.
• High pin-count, compact package: 1932-BBGA (45×45) FCBGA package enables a dense integration footprint while delivering large I/O and power distribution options.
• Standards-aligned compliance: RoHS compliance helps meet environmental regulations for product manufacturing.

Why Choose 5SGXEA9N2F45I2LN?

The 5SGXEA9N2F45I2LN delivers a balance of very high logic capacity, significant embedded memory, and large I/O resources in an industrial-grade Stratix V GX FPGA footprint. It is positioned for designs that require consolidation of complex logic, on-chip data storage, and broad interfacing capability within a single high-pin-count package.

Engineers and system designers targeting industrial applications, advanced digital processing, or high-density integration will find the device’s combination of resources and documentation appropriate for scaling prototypes into production designs while maintaining thermal and supply-voltage constraints defined by the device specifications.

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