5SGXEA9N2F45I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 526 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEA9N2F45I2G – Stratix V GX FPGA, 840K Logic Elements, 1932-BBGA
The 5SGXEA9N2F45I2G is an Intel Stratix® V GX field programmable gate array (FPGA) provided in a 1932-BBGA (FCBGA) package. This industrial-grade device delivers a large programmable fabric with 840,000 logic elements and a high I/O count for dense, board-level integration.
Designed for applications that require substantial on-chip resources, the device combines a large logic capacity with approximately 53.25 Mbits of embedded memory and up to 840 I/O pins, while supporting a core supply voltage range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 840,000 logic elements provide a high-density programmable fabric for complex digital designs.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support large buffers, state machines, and data paths.
- I/O Density Up to 840 I/O pins to enable extensive peripheral and high-pin-count board interfaces.
- Package and Mounting 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
- Industrial Temperature Grade Specified operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
- Power Core voltage supply specified between 870 mV and 930 mV to meet the device’s operating requirements.
- Standards Compliance RoHS compliant.
- Stratix V GX Family Part of the Stratix V GX family; family-level documentation references industrial and commercial speed grades for Stratix V GX devices.
Typical Applications
- High-density FPGA designs For systems that require up to 840,000 logic elements and substantial embedded memory on a single device.
- High-pin-count interface boards Suitable for designs needing up to 840 I/O pins for extensive peripheral connectivity and board-level routing.
- Industrial-grade deployments Applications that must operate across a wide temperature range (−40 °C to 100 °C) and comply with RoHS.
Unique Advantages
- Large programmable fabric: 840,000 logic elements enable implementation of complex, highly parallel logic and large-scale state machines on a single FPGA.
- Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduce external memory dependence and simplify board design.
- High I/O availability: Up to 840 I/O pins support dense connectivity and multiple high-pin-count interfaces without external multiplexing.
- Industrial operating range: −40 °C to 100 °C rating supports operation in challenging thermal environments common in industrial applications.
- Standard surface-mount package: 1932-BBGA (45×45) package provides a compact, assembly-friendly footprint for high-density PCB layouts.
- RoHS compliant: Meets lead-free and hazardous-substance requirements for environmentally conscious designs.
Why Choose 5SGXEA9N2F45I2G?
The 5SGXEA9N2F45I2G delivers a combination of large logic capacity, sizable embedded memory, and extensive I/O in a single industrial-grade Stratix V GX device. It is positioned for designs that require significant on-chip resources and a wide operating temperature window while remaining compatible with standard surface-mount assembly and RoHS mandates.
This part is well suited for engineering teams designing high-density, resource-intensive systems that benefit from integrated memory and high I/O count, offering a clear path for scalable, robust implementations within the Stratix V GX family document set.
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