5SGXEA9N2F45C3N

The 5SGXEA9N2F45C3N is an Intel Stratix® V GX Field Programmable Gate Array supplied in a 1932-BBGA FCBGA package. It provides high logic density and large on-chip memory with a commercial-grade operating temperature range, making it suitable for demanding board-level FPGA designs that require substantial logic, I/O capacity, and on-chip RAM.

Key Features

• Core Capacity  Approximately 840,000 logic elements providing substantial programmable fabric for complex digital logic and custom accelerators.
• Logic Blocks  317,000 logic blocks for granular logic partitioning and resource planning.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffering, frame storage, and data-path implementations.
• I/O Density  840 I/Os to support wide parallel interfaces, multiple high-pin-count peripherals, and board-level connectivity.
• Power and Core Voltage  Core supply range specified from 820 mV to 880 mV for accurate power budgeting and thermal design.
• Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45) with surface-mount mounting for compact board integration.
• Temperature Grade  Commercial grade with operating temperature range 0 °C to 85 °C for standard commercial deployments.
• Environmental Compliance  RoHS compliant to meet regulatory requirements for lead-free assembly.

Typical Applications

• High-density compute modules  Leverage approximately 840,000 logic elements and large embedded RAM to implement complex datapath logic and custom compute functions.
• I/O-intensive systems  Use the 840 available I/Os for designs requiring many parallel interfaces, multi-channel data aggregation, or board-level peripheral connectivity.
• Embedded memory-centric designs  Deploy roughly 53.25 Mbits of on-chip RAM for buffering, packet processing, and temporary storage inside the FPGA fabric.

Unique Advantages

• High integration density: The combination of ~840K logic elements and 317,000 logic blocks enables consolidation of large digital subsystems into a single device, reducing board-level component count.
• Ample on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces dependency on external memory for many buffering and data-path tasks, simplifying layout and improving latency.
• Large I/O complement: With 840 I/Os, the device supports complex interfacing schemes and multiple parallel channels without external multiplexing logic.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match mainstream commercial product deployments and lab/prototype environments.
• Surface-mount BBGA packaging: The 1932-BBGA FCBGA (1932-FBGA, FC 45×45) enables high pin-count routing in compact board footprints for dense system designs.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing flows and environmental requirements.

Why Choose 5SGXEA9N2F45C3N?

The 5SGXEA9N2F45C3N delivers a compelling balance of programmable logic density, substantial embedded memory, and extensive I/O capability in a single commercial-grade Stratix V GX FPGA package. Its specification set is well-suited to engineers designing complex digital systems that require on-chip resources to minimize external components and optimize board-level integration.

Choose this FPGA when your design requires high logic capacity, significant on-chip RAM, and high I/O counts while operating within a commercial temperature range. The device’s package and supply characteristics support compact, surface-mounted board layouts and careful power budgeting based on the specified core voltage range.

Request a quote or submit a quote request to obtain pricing, lead-time, and availability for the 5SGXEA9N2F45C3N. Our team can provide the details you need to move from evaluation to production planning.