5SGXEA9N2F45I3G

The 5SGXEA9N2F45I3G is an Intel Stratix V GX field programmable gate array (FPGA) device provided in a 1932-ball BGA package. It delivers a high-density programmable fabric with a large amount of embedded RAM and extensive I/O to support complex digital designs.

Designed for industrial-grade applications, the device combines 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/O pins in a 1932-FBGA (45×45) form factor. Supply and thermal ranges are specified for integration into robust systems.

Key Features

• Core Logic  840,000 logic elements (LEs) provide a high-density programmable fabric for implementing complex logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and storage close to logic to reduce external memory dependence.
• I/O Capacity  840 user I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Package & Mounting  1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC (45×45)) with surface-mount assembly for compact, high-density board designs.
• Power Supply  Specified operating voltage range of 820 mV to 880 mV to match system power-rail planning and regulator selection.
• Temperature & Grade  Industrial-grade qualification with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Standards Compliance  RoHS compliant to meet environmental and regulatory requirements for lead-free assembly.
• Series-Level Documentation  Series datasheet (Stratix V device datasheet) covers electrical and switching characteristics, including transceiver and I/O timing guidance for system integration.

Typical Applications

• High-speed communications  Use where dense logic and extensive I/O are required to implement protocol stacks, packet processing, or transceiver-based interfaces described in the Stratix V series documentation.
• Signal processing and acceleration  Large configurable logic and significant on-chip RAM support implementation of real-time filters, data aggregation, and custom accelerators.
• Complex digital systems  Suitable for systems that require high I/O counts and large programmable fabrics for glue logic, protocol bridging, or bespoke hardware functions.

Unique Advantages

• High logic density: 840,000 logic elements enable integration of large designs on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM allow significant buffering and local data storage to improve system determinism.
• Extensive I/O: 840 I/O pins support broad peripheral connectivity and parallel interfaces without additional multiplexing hardware.
• Industrial operating range: Rated for −40°C to 100°C operation to meet the needs of thermally demanding or outdoor deployments.
• Compact BGA packaging: 1932-ball FCBGA (45×45) package provides high pin count in a compact footprint for dense PCB layouts.
• Environmentally compliant: RoHS compliance simplifies adherence to lead-free assembly and environmental directives.

Why Choose 5SGXEA9N2F45I3G?

This Stratix V GX device offers a balance of high logic capacity, significant on-chip RAM, and broad I/O in a single, industrial-grade FPGA package. The specified voltage and thermal ranges, together with the 1932-BBGA package, make it suitable for designs that demand dense integration and reliable operation in challenging environments.

Engineers and procurement teams targeting designs that require large programmable arrays, ample embedded memory, and high I/O density will find this device appropriate for complex communications, signal processing, and custom hardware acceleration projects. Series-level datasheet material is available to support electrical and transceiver integration requirements.

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