5SGXEA9N3F45C2LG

The 5SGXEA9N3F45C2LG is an Intel Stratix® V GX field-programmable gate array (FPGA) optimized for high-density, high-bandwidth designs. It combines a large logic fabric with substantial on-chip memory and a high I/O count to support complex digital processing tasks and dense system integration.

Built for commercial-temperature applications, this Stratix V GX device provides a balance of integration and configurability for designs that require abundant logic resources, embedded memory, and extensive I/O connectivity in a 1932-ball FCBGA package.

Key Features

• Logic Capacity — 840,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, packet storage, and on-device data management.
• I/O Density — 840 I/O pins to support broad peripheral interfacing, multi-channel connectivity, and high pin-count designs.
• Power Supply — Core supply range of 820 mV to 880 mV to match system power-rail designs and support specified operating conditions.
• Package & Mounting — 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact board-level integration.
• Temperature Grade — Commercial grade with an operating range of 0 °C to 85 °C for standard commercial-environment deployments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

• High-performance digital processing — Use the large logic capacity and embedded RAM for computation-heavy tasks such as acceleration engines, custom datapaths, and real-time processing.
• Networking and communications systems — High I/O count and Stratix V GX family capabilities suit implementations of packet processing, switching fabrics, and multi-channel interfaces.
• Data-center and compute accelerators — Dense logic and memory resources enable offload functions and specialized compute blocks within server or appliance designs.

Unique Advantages

• High logic density: 840,000 logic elements provide room for complex finite-state machines, wide datapaths, and large custom hardware blocks without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependency and improves latency for buffering and local storage.
• Extensive I/O support: 840 I/Os enable connection to numerous peripherals, parallel interfaces, and multi-lane systems directly from the FPGA.
• Compact system footprint: 1932-ball FCBGA (45×45) package allows high integration density on PCB designs while remaining surface-mount compatible.
• Commercial temperature readiness: Rated for 0 °C to 85 °C operation to meet typical commercial deployment environments.
• Regulatory compliance: RoHS compliance supports lead-free assembly and simplifies regulatory considerations.

Why Choose 5SGXEA9N3F45C2LG?

This Stratix V GX device is positioned for designs that demand substantial programmable logic, embedded memory, and high I/O capacity in a single commercial-grade FPGA. Its combination of 840,000 logic elements, roughly 53.25 Mbits of on-chip RAM, and 840 I/Os makes it suitable for complex digital signal processing, network packet processing, and compute-acceleration applications where integration and board-level density matter.

Choosing this part offers a scalable platform for engineers who require large fabric resources and extensive connectivity in a surface-mount FCBGA package, with RoHS compliance and specified commercial operating conditions for mainstream electronics applications.

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