5SGXEA9N2F45C2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 1,325 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9N2F45C2L – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA9N2F45C2L is a Stratix V GX family FPGA offering high logic density and large on‑chip memory for complex digital designs. As a commercial‑grade, surface‑mount device in a 1932‑BBGA (FCBGA) package, it addresses applications that require substantial programmable logic, abundant I/O, and significant embedded RAM.

Key value comes from a combination of 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 840 I/O pins, enabling integration of data‑path, control, and interface functions into a single device footprint.

Key Features

  • Core Logic 840,000 logic elements suitable for large-scale digital designs and complex state machines.
  • Embedded Memory Approximately 53.25 Mbits of on‑chip RAM to support buffering, lookup tables, and intermediate data storage.
  • I/O Capacity Up to 840 I/O pins to accommodate dense peripheral interfacing, wide buses, and multi‑lane I/O architectures.
  • Power Supply Core voltage supply range of 820 mV to 880 mV for the device core.
  • Package & Mounting 1932‑BBGA / FCBGA package (supplier package: 1932‑FBGA, FC 45×45) with surface‑mount mounting for high‑density board designs.
  • Operating Temperature & Grade Commercial grade with an operating temperature range of 0°C to 85°C.
  • Standards & Compliance RoHS‑compliant device for environmental and regulatory compatibility in commercial applications.
  • Stratix V GX Family Part of the Stratix V GX device family as described in the Stratix V device datasheet, offering device and electrical characteristic coverage for this series.

Typical Applications

  • Network and Telecommunications — High logic density and extensive I/O make this FPGA suitable for packet processing, protocol bridging, and multi‑lane interface implementations.
  • High‑Performance Digital Systems — Large embedded memory and many logic elements support complex data‑path processing and algorithm acceleration.
  • System Prototyping and Integration — Integrate multiple functions (control, interface, and data buffering) on a single device to reduce board complexity and bill of materials.

Unique Advantages

  • High Logic Density: 840,000 logic elements enable consolidation of larger functions into a single FPGA, reducing the need for multiple devices.
  • Substantial On‑Chip RAM: Approximately 53.25 Mbits of embedded memory supports deep buffering and large lookup structures without external memory.
  • Extensive I/O Count: Up to 840 I/Os provide flexibility for wide buses, parallel interfaces, and multiple peripheral connections.
  • Compact, High‑Pin Package: 1932‑BBGA (FCBGA) delivers high pin‑count in a compact surface‑mount footprint for dense system designs.
  • Commercial Temperature and RoHS Compliance: Specified 0°C to 85°C operating range and RoHS compliance for commercial product lines.
  • Part of a Supported Device Family: Inclusion in the Stratix V GX family ensures alignment with documented device electrical and switching characteristics in the Stratix V device datasheet.

Why Choose 5SGXEA9N2F45C2L?

The 5SGXEA9N2F45C2L combines very high logic capacity, significant embedded memory, and a large I/O complement in a single commercial‑grade FCBGA package, making it well suited for demanding digital systems that need integration and scalability. Its voltage and thermal specifications are provided for commercial deployments where designers require verifiable device parameters for system validation.

This device is appropriate for engineering teams and procurement groups building high‑density, feature‑rich FPGA solutions that prioritize on‑chip resources and I/O flexibility while maintaining commercial temperature operation and RoHS compliance.

Request a quote or submit a pricing inquiry through your preferred procurement channel to obtain availability and lead‑time information for the 5SGXEA9N2F45C2L.

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