5SGXEA9N1F45C2N

The 5SGXEA9N1F45C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in a high-density commercial-grade device package. It provides a large programmable fabric, abundant I/O, and substantial embedded memory for complex digital designs that require significant logic capacity and on-chip storage.

This device is suited for applications that demand high logic density and extensive I/O integration while operating within a commercial temperature range. Key product attributes include 840,000 logic elements, approximately 53.2 Mbits of on‑chip RAM, and 840 I/O pins in a 1932-BBGA FCBGA package.

Key Features

• Logic Capacity  840,000 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM (53,248,000 bits) for data buffering, state storage, and memory-centric logic.
• I/O Density  840 user I/O pins to support wide parallel interfaces and multiple external connections.
• Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC (45×45)) with surface-mount mounting type for compact board integration.
• Power Supply  Core voltage range of 870 mV to 930 mV to align with defined device operating rails.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital logic  Implement complex state machines, custom datapaths, and large combinational/sequential logic using the device's 840,000 logic elements.
• Memory-intensive designs  Use the approximately 53.2 Mbits of embedded RAM for buffering, FIFOs, and on-chip data storage to reduce external memory dependence.
• I/O-intensive interface bridging  Leverage 840 I/O pins to interface with multiple peripherals, parallel buses, or multi-lane board-level connections.

Unique Advantages

• Large programmable fabric: 840,000 logic elements provide headroom for complex IP integration and multi-function designs.
• Substantial on-chip memory: Approximately 53.2 Mbits of RAM enables memory-heavy algorithms and reduces the need for external memory in many use cases.
• High I/O count: 840 I/O pins facilitate dense board-level connectivity and flexible interface options.
• Compact BGA package: 1932-BBGA/1932-FBGA (45×45) package allows high density on PCB footprints while supporting surface-mount assembly.
• Commercial operating range: Rated for 0 °C to 85 °C to meet standard commercial product requirements.
• RoHS compliant: Conforms to RoHS requirements for regulatory and environmental considerations.

Why Choose 5SGXEA9N1F45C2N?

The 5SGXEA9N1F45C2N delivers a combination of high logic density, significant embedded memory, and a large I/O complement in a single commercial-grade Stratix V GX FPGA package. Its specification set is suited to designers who need a high-capacity programmable platform for sophisticated digital processing, interface aggregation, and memory-centric implementations.

As a Stratix V GX family device from Intel, this FPGA is positioned for projects that require scalable logic resources and robust on-chip RAM while maintaining a compact board footprint and standard commercial temperature operation.

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