5SGXEA9K3H40I3N

The 5SGXEA9K3H40I3N is a Stratix® V GX field programmable gate array (FPGA) device packaged in a 1517-BBGA FCBGA. It delivers a high-density programmable fabric with 840,000 logic elements and approximately 53 Mbits of embedded memory for complex digital processing and system integration.

Designed for industrial-grade applications, the device combines a large I/O count with a compact surface-mount FCBGA package and a defined core supply range, making it suitable for designs that require high logic capacity, sizable on-chip RAM, and robust operating temperature support.

Key Features

• Core Logic  840,000 logic elements for implementing large-scale digital logic and custom architectures.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support buffering, lookup tables, and complex state machines.
• I/O Density  696 user I/Os to connect multiple peripherals, interfaces, and high-pin-count system designs.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV to support defined power domains and board-level power planning.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), surface-mount mounting for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, enabling deployment in temperature-challenging environments.
• Compliance  RoHS compliant to meet lead-free manufacturing and environmental requirements.

Typical Applications

• High-density digital processing  Use the device where large programmable fabric and embedded RAM are required for custom compute pipelines and control logic.
• Complex I/O aggregation  Ideal for systems that need many external interfaces or parallel connections, leveraging the 696 I/O pins for signal routing.
• Industrial equipment and instrumentation  Suited to industrial systems that require extended operating temperatures and a robust package for reliable board-level integration.

Unique Advantages

• High logic capacity: 840,000 logic elements enable large, integrated designs without immediate reliance on multiple devices.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM reduces external memory needs and simplifies board design.
• Extensive I/O resources: 696 I/Os provide flexibility for complex interconnects, multi-channel interfaces, and dense system routing.
• Industrial temperature rating: −40 °C to 100 °C qualification supports deployment in demanding thermal environments.
• Compact FCBGA package: 1517-BBGA (45×45 supplier package) offers a high-pin-count solution in a surface-mount form factor for space-constrained boards.
• Regulatory readiness: RoHS compliance supports environmentally constrained manufacturing processes.

Why Choose 5SGXEA9K3H40I3N?

The 5SGXEA9K3H40I3N positions itself as a high-density, industrial-grade Stratix V GX FPGA suited for designs that demand large programmable logic resources, significant on-chip memory, and a high number of I/Os. Its defined core voltage range and surface-mount FCBGA package simplify power and board-level integration while supporting robust thermal operation.

This device is appropriate for engineering teams targeting scalable, high-capacity FPGA implementations where consolidation of functionality onto a single, industrial-rated device provides long-term value in reliability and system integration.

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