5SGXEA9K3H40I3G

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 184 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9K3H40I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA9K3H40I3G is an Intel Stratix V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package, offered in an industrial temperature grade. It delivers a high-density programmable logic platform with large embedded memory and extensive I/O for demanding digital designs.

Built for applications that require substantial logic capacity, on-chip RAM, and high I/O counts, this device is positioned to support complex system integration while operating across an industrial temperature range.

Key Features

  • High logic density — 840,000 logic elements enable large-scale digital designs and complex logic implementation.
  • Significant embedded memory — approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage.
  • Extensive I/O — 696 user I/O pins provide flexible interfacing to peripherals, memory, and high-pin-count systems.
  • GX transceiver family capability — the Stratix V GX family includes transceiver speed grades referenced in the device datasheet (series-level capability up to 14.1 Gbps for certain grades).
  • Power and core voltage — core supply operating range from 820 mV to 880 mV for the device core.
  • Robust package and mounting — supplied in a 1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 45×45) and designed for surface-mount assembly.
  • Industrial temperature grade — specified operating temperature range from −40 °C to 100 °C for reliable operation in industrial environments.
  • RoHS compliant — meets RoHS environmental requirements.

Typical Applications

  • High-performance communications — large logic capacity and family-level high-speed transceivers make the device suitable for programmable interface and protocol processing.
  • Data-path acceleration — abundant embedded RAM and logic elements support on-chip buffering and pipeline architectures for data acceleration tasks.
  • Signal processing — the combination of dense logic resources and high I/O count enables complex digital signal processing and multi-channel I/O systems.
  • Industrial control and automation — industrial temperature rating and extensive I/O support integration into harsh-environment control systems.

Unique Advantages

  • Large programmable fabric: 840,000 logic elements provide capacity for complex algorithms and multi-function designs, reducing the need for multiple FPGAs.
  • On-chip memory to simplify system design: approximately 53.25 Mbits of embedded RAM lowers external memory dependency and streamlines data-path implementation.
  • High I/O connectivity: 696 I/O pins give designers flexibility for parallel interfaces, high-pin-count peripherals, and multi-channel signal routing.
  • Industrial thermal range: −40 °C to 100 °C operation supports deployment in industrial and temperature-challenging applications.
  • Production-ready packaging: 1517-BBGA (FCBGA) with surface-mount mounting supports standard PCB assembly and mechanical integration.
  • Regulatory readiness: RoHS compliance assists in meeting environmental and regulatory requirements for commercial products.

Why Choose 5SGXEA9K3H40I3G?

The 5SGXEA9K3H40I3G delivers substantial logic capacity, sizeable embedded memory, and high I/O density in an industrial-grade Stratix V GX package. It is suited for engineers building complex, high-performance programmable systems that require integrated memory and extensive external interfacing while maintaining operation across broad temperature ranges.

For designs that require scalability and a robust FPGA platform, this device provides a combination of resources and package options that supports integration into demanding communications, signal processing, and industrial control systems, backed by the Stratix V family datasheet specifications.

Request a quote or submit an inquiry to evaluate 5SGXEA9K3H40I3G for your next design.

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