5SGXEA9K3H40I3LN

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,193 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEA9K3H40I3LN – Stratix® V GX Field Programmable Gate Array (FPGA), 1517-BBGA FCBGA

The 5SGXEA9K3H40I3LN is a Stratix V GX family FPGA IC designed for industrial-grade, high-capacity programmable logic implementations. It combines a very large logic fabric with substantial on‑chip memory and extensive I/O density to address complex, I/O‑intensive designs.

Key value propositions include a large logic element count, approximately 53 Mbits of embedded memory, hundreds of user I/Os, and an industrial operating temperature range—making it suitable for demanding embedded and infrastructure applications that require significant programmable logic and memory resources.

Key Features

  • Logic Capacity  Provides 840,000 logic elements for implementing large-scale digital designs and complex logic functions.
  • Embedded Memory  Includes a total of 53,248,000 bits of on-chip RAM (approximately 53 Mbits) to support buffering, tables, and local data storage.
  • I/O Density  Offers 696 user I/O pins to support a wide range of external interfaces and high-channel-count connections.
  • Package  Supplied in a 1517‑BBGA FCBGA package (supplier device package: 1517‑HBGA, 45×45), optimized for high pin-count surface-mount deployment.
  • Power  Core voltage supply range of 820 mV to 880 mV to match required FPGA core power rails.
  • Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C for industrial-environment reliability.
  • Mounting  Surface mount package suitable for PCB assembly processes.
  • Regulatory  RoHS compliant for lead‑free manufacturing and environmental requirements.

Typical Applications

  • High-density networking and switching  Large logic capacity and high I/O count enable packet processing and protocol handling in infrastructure equipment.
  • Signal processing and compute acceleration  Substantial logic elements and embedded RAM support real-time DSP, compute offload, and data-path implementations.
  • Industrial control and automation  Industrial temperature rating and robust I/O make the device suited for control systems and automation platforms requiring on-board programmability.
  • Custom system integration  High I/O density and a large programmable fabric allow integration of multiple functions into a single FPGA for space- and BOM-constrained designs.

Unique Advantages

  • Large on-chip logic and memory:  840,000 logic elements combined with approximately 53 Mbits of embedded RAM reduce the need for external logic and memory components.
  • High I/O availability:  696 user I/Os support dense connectivity and multiple parallel interfaces without additional multiplexing hardware.
  • Industrial temperature rating:  Rated from −40 °C to 100 °C for reliable operation in harsher environments and extended temperature ranges.
  • Compact high-pin-count package:  1517‑BBGA / 1517‑HBGA (45×45) package delivers high pin density in a surface-mount form factor for advanced board layouts.
  • Defined low-voltage core:  820–880 mV supply requirement aligns with modern low-voltage FPGA cores for power-managed system designs.
  • RoHS compliant:  Supports lead‑free manufacturing workflows and environmental compliance needs.

Why Choose 5SGXEA9K3H40I3LN?

The 5SGXEA9K3H40I3LN positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that demand significant programmable logic, on-chip memory, and extensive I/O. Its combination of 840,000 logic elements, approximately 53 Mbits of embedded RAM, and nearly 700 I/Os supports consolidation of complex subsystems into a single device, simplifying BOM and board-level complexity.

This device is appropriate for engineering teams developing infrastructure, signal processing, or industrial control systems that require a robust, high-density programmable platform with industrial temperature support and a high-pin-count package for advanced integrations.

Request a quote or submit a procurement inquiry to learn about availability, pricing, and lead times for the 5SGXEA9K3H40I3LN.

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