5SGXEB5R1F40C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40) |
|---|---|
| Quantity | 1,017 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R1F40C2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)
The 5SGXEB5R1F40C2LG is a Stratix V GX field programmable gate array (FPGA) designed for high-density, programmable digital logic implementations. As a member of the Stratix V GX family, it delivers a large logic capacity and substantial on-chip memory within a compact 1517‑FBGA (40×40) surface-mount package.
With 490,000 logic elements, approximately 42 Mbits of embedded memory, and 432 user I/O pins, this commercial-grade device (0 °C to 85 °C) is targeted at designs that require significant programmable logic, memory resources, and dense I/O integration while meeting RoHS compliance.
Key Features
- Core Logic Capacity 490,000 logic elements to support complex digital designs and large-scale programmable functions.
- Embedded Memory Approximately 42 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
- I/O Count 432 user I/O pins enabling dense external connectivity and interface flexibility.
- Package & Mounting 1517‑FBGA (40×40) supplier device package, surface-mount mounting type for high-density PCB integration.
- Power Core voltage supply range of 820 mV to 880 mV to match platform power-rail requirements.
- Commercial Temperature Grade Specified for 0 °C to 85 °C operation for commercial embedded applications.
- Compliance RoHS compliant for environmental and regulatory requirements.
Typical Applications
- High-density programmable logic systems Implement complex state machines, datapaths, and custom accelerators using the device’s large logic resource pool and on-chip RAM.
- I/O‑intensive designs Integrate with multiple peripherals and interfaces using up to 432 user I/O pins in a compact BGA footprint.
- Commercial embedded platforms Deploy in commercial-temperature embedded systems that require RoHS compliance and surface-mount assembly.
Unique Advantages
- High logic density: 490,000 logic elements enable consolidation of complex functions into a single device, reducing system BOM and board area.
- Substantial on-chip memory: Approximately 42 Mbits of embedded RAM support data buffering and local storage for high-throughput designs.
- Extensive I/O: 432 I/O pins provide flexibility for interfacing with dense peripheral and memory ecosystems.
- Compact BGA package: The 1517‑FBGA (40×40) package delivers a space-efficient solution for high-pin-count designs.
- Commercial-grade operating range: Qualified for 0 °C to 85 °C operation to match commercial embedded application requirements.
- RoHS compliant: Meets environmental compliance expectations for modern electronic products.
Why Choose 5SGXEB5R1F40C2LG?
The 5SGXEB5R1F40C2LG combines large-scale programmable logic, significant embedded memory, and extensive I/O in a compact surface-mount FBGA package, making it well suited for commercial embedded designs that require high integration and flexible interfacing. As part of the Stratix V GX family, it aligns with the documentation and electrical characteristics defined for the series while providing the specific resource counts and package attributes needed for advanced digital designs.
Design teams seeking to consolidate complex functions, reduce board-level component count, and leverage a high-density FPGA platform will find this device appropriate for scalable, performance-oriented projects where commercial-temperature operation and RoHS compliance are required.
Request a quote or submit a pricing inquiry for 5SGXEB5R1F40C2LG to receive availability and lead-time information tailored to your project needs.

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