5SGXEB5R1F40C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40) |
|---|---|
| Quantity | 683 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R1F40C1N – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEB5R1F40C1N is a Stratix® V GX-class FPGA from Intel, provided in a 1517-FBGA (40×40) surface-mount package for commercial applications. It delivers a high logic capacity and significant on-chip memory to support complex, high-density programmable logic designs.
Designed for commercial-temperature operation, this device combines a large number of logic elements, substantial embedded RAM, and a wide complement of I/O to support compute- and I/O-intensive designs within a compact BGA footprint.
Key Features
- Logic Capacity Approximately 490,000 logic elements to support large-scale, highly integrated FPGA designs.
- Logic Fabric (CLBs) Around 185,000 CLB resources for building complex logic and datapath structures.
- Embedded Memory Approximately 42 Mbits of embedded memory (41,984,000 bits) for on-chip buffering, FIFOs, and local storage.
- Flexible I/O 432 general-purpose I/O pins to interface with external peripherals, memory, and high-pin-count systems.
- Power Supply Core voltage range specified from 870 mV to 930 mV to meet system power design requirements.
- Package & Mounting 1517-FBGA (40×40) package, surface-mount mounting type for compact PCB integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial deployments.
- RoHS Compliant Manufactured in accordance with RoHS requirements.
Typical Applications
- High-density programmable logic Large-scale FPGA implementations that require hundreds of thousands of logic elements and substantial embedded RAM for on-chip processing and control.
- Data-path acceleration Custom accelerators and datapath engines that benefit from abundant logic resources and local memory for buffering and pipeline stages.
- Complex I/O systems Systems requiring a high number of external interfaces and parallel connectivity using the device’s 432 I/O pins.
- Commercial embedded systems Embedded designs operating in commercial temperature ranges that need a compact BGA footprint and surface-mount assembly.
Unique Advantages
- High logic density: 490,000 logic elements offer the capacity to implement large-scale, feature-rich FPGA designs without splitting functionality across multiple devices.
- Significant on-chip memory: Approximately 42 Mbits of embedded RAM reduces external memory dependence and lowers system latency for buffer- and state-intensive designs.
- Extensive I/O count: 432 I/O pins provide design flexibility for parallel interfaces, multiple peripherals, and high-pin-count system integration.
- Compact package: 1517-FBGA (40×40) delivers a space-efficient solution for dense board layouts while supporting surface-mount manufacturing.
- Commercial-ready thermal range: Rated 0 °C to 85 °C to match typical commercial deployment environments and system-level thermal profiles.
- Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose 5SGXEB5R1F40C1N?
This Stratix® V GX FPGA combines very large logic resources, substantial embedded memory, and a high I/O count in a compact 1517-FBGA package—making it well suited for demanding commercial FPGA applications that need integration density and on-chip storage. The device’s specified core voltage range and commercial temperature rating provide clear design parameters for power and thermal planning.
Choose the 5SGXEB5R1F40C1N when your design requires high-capacity programmable logic, plentiful on-chip RAM, and extensive I/O in a surface-mount BGA form factor, backed by Intel’s Stratix V device family specifications.
Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEB5R1F40C1N.

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