5SGXEB5R1F40C2LN

The 5SGXEB5R1F40C2LN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, delivered in a 1517‑FBGA (40×40) package for surface-mount assembly. This commercial‑grade device combines high logic capacity, substantial on‑chip RAM, and a large I/O count for complex digital designs.

Engineered for applications that require dense logic, extensive embedded memory, and broad I/O connectivity, the device operates from a core supply of 820 mV to 880 mV and across a commercial temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic  490,000 logic elements provide extensive capacity for large-scale digital integration and complex finite state machines.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM to support buffering, on‑chip data storage, and LUT-based memory functions.
• I/O Resources  432 user I/O pins accommodate wide parallel interfaces, multiple peripheral connections, and extensive system-level interconnects.
• Package & Mounting  1517‑FBGA (40×40) package optimized for surface mount installation, enabling compact board layouts and high pin density.
• Power  Core voltage supply range from 820 mV to 880 mV for the device core.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and environmental assurance.

Typical Applications

• High‑density digital systems  Suitable for designs that require large logic capacity and substantial on‑chip memory for integration of complex digital functions.
• Data buffering and memory‑intensive processing  On‑chip RAM supports local buffering and intermediate data storage for signal processing and algorithm acceleration.
• Multi‑interface controllers  432 I/O pins enable implementation of wide buses, peripheral aggregation, and multi‑lane interfacing on a single device.

Unique Advantages

• Large logic capacity: 490,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• Significant embedded memory: Approximately 42 Mbits of RAM reduces external memory dependencies for many designs, improving latency and simplifying PCB layouts.
• High I/O count: 432 I/O pins support broad connectivity needs without resorting to additional devices or multiplexing schemes.
• Compact ball‑grid packaging: The 1517‑FBGA (40×40) package delivers high pin density in a compact footprint for space‑constrained boards.
• Commercial temperature grade: Rated for 0 °C to 85 °C, suitable for a wide range of commercial and enterprise applications.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose 5SGXEB5R1F40C2LN?

The 5SGXEB5R1F40C2LN delivers a combination of high logic element count, substantial embedded memory, and a large I/O complement in a compact 1517‑FBGA package—appropriate for designers consolidating complex digital subsystems onto a single FPGA. Its commercial operating range and RoHS compliance make it a practical choice for enterprise and commercial products that demand on‑chip resources and high interconnect density.

This Stratix V GX device is well suited to development teams and procurement groups seeking a high‑capacity FPGA option with clear, verifiable specifications for logic, memory, I/O, packaging, and operating conditions.

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