5SGXEABN3F45I4N

The 5SGXEABN3F45I4N is an industrial-grade Stratix V GX field-programmable gate array (FPGA) from Intel. It delivers very high logic density and large embedded memory capacity in a 1932-ball FCBGA package for surface-mount assembly.

Designed for applications that require extensive I/O connectivity and significant on-chip memory, this device provides a combination of high logic element capacity, broad I/O count, and low-voltage core operation suitable for demanding industrial environments.

Key Features

• High Logic Capacity  Approximately 952,000 logic elements to implement large-scale digital logic and complex custom architectures.
• Embedded Memory  Approximately 53.25 Mbits of total on-chip RAM to support buffering, large state machines, and data-path storage.
• Extensive I/O  Up to 840 user I/Os to interface with multiple peripherals, buses, and high-pin-count systems.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package specified as 1932-FBGA, FC (45×45), and intended for surface-mount PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial-temperature deployments.
• Low-Voltage Core Supply  Core voltage range of 0.82 V to 0.88 V for optimized power-domain integration.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Large logic capacity and wide operating temperature range support complex control algorithms and robust industrial deployments.
• High-Density I/O Systems  High I/O count enables aggregation of many sensor, actuator, or interface channels in a single FPGA solution.
• Data Path Acceleration  Substantial on-chip RAM and logic resources are suited for packet processing, buffering, and custom data-path implementations.
• Communications & Connectivity  Stratix V GX family heritage addresses high-speed serial and parallel interfacing needs where large logic and memory resources are required.

Unique Advantages

• Very high logic density: Approximately 952,000 logic elements enable integration of complex functions that reduce external components and PCB complexity.
• Large on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffers, lookup tables, and on-chip data storage for latency-sensitive designs.
• Massive I/O capability: 840 I/Os facilitate multi-channel interfacing and system consolidation.
• Industrial-rated operation: −40 °C to 100 °C temperature rating supports deployment in harsh and variable environments.
• Compact, manufacturable package: 1932-ball FCBGA (45×45 mm) package optimized for surface-mount assembly in compact, high-density boards.
• Low-voltage core: 0.82–0.88 V core supply range supports integration into power-optimized systems.

Why Choose 5SGXEABN3F45I4N?

The 5SGXEABN3F45I4N positions itself as a high-capacity Stratix V GX FPGA targeted at industrial applications that demand a combination of significant logic resources, large embedded memory, and broad I/O connectivity. Its industrial temperature rating and RoHS compliance make it suitable for long-lived deployments where environmental tolerance and regulatory compliance matter.

Engineers designing complex control systems, high-density I/O platforms, or on-board data acceleration can leverage the device’s integration to reduce BOM and consolidate functionality, while relying on Intel’s Stratix V family documentation for device-level electrical and switching characteristics.

Request a quote or submit an availability inquiry to obtain pricing, lead time, and further ordering information for the 5SGXEABN3F45I4N.