5SGXEABN3F45I3N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 738 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEABN3F45I3N – Stratix® V GX FPGA, 952,000 logic elements, 840 I/Os

The 5SGXEABN3F45I3N is an Intel Stratix V GX Field Programmable Gate Array (FPGA) supplied in a 1932-BBGA FCBGA package. It provides a high logic capacity and substantial on-chip memory for demanding programmable-logic designs while offering a high I/O count and industrial temperature qualification.

Key architectural attributes include 952,000 logic elements and approximately 53 Mbits of embedded memory, making this device suitable for applications that require large programmable logic resources and extensive I/O connectivity within a surface-mount 1932-pin BGA footprint.

Key Features

  • Logic Capacity — 952,000 logic elements for implementing large-scale, complex digital designs.
  • Embedded Memory — Approximately 53 Mbits of on-chip RAM to support deep buffering, large state machines, and data-path storage.
  • I/O Density — 840 general-purpose I/Os to support high pin-count interfaces and parallel connectivity requirements.
  • Power Supply — Core voltage range of 820 mV to 880 mV for the device core supply.
  • Package & Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
  • Temperature Grade — Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
  • Standards & Compliance — RoHS compliant.

Unique Advantages

  • Large programmable resource pool: 952,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 53 Mbits of embedded RAM supports large buffers and on-chip data processing without immediate external memory dependence.
  • High I/O count: 840 I/Os provide flexibility for parallel interfaces, memory buses, and extensive peripheral connectivity.
  • Industrial temperature operation: Rated from −40 °C to 100 °C to meet demanding thermal environments.
  • Compact high-pin-count package: 1932-ball FCBGA (45×45) offers high signal density in a surface-mount form factor appropriate for space-constrained PCBs.
  • Regulatory compliance: RoHS compliance simplifies integration into systems with environmental and materials requirements.

Why Choose 5SGXEABN3F45I3N?

The 5SGXEABN3F45I3N positions itself as a high-capacity, industrial-grade Stratix V GX FPGA option for designs that demand a combination of large logic resources, significant on-chip memory, and extensive I/O. Its core voltage range and industrial temperature rating make it suitable for robust embedded systems operating across wide environmental conditions.

As part of the Stratix V family, the device is supported by formal device documentation and datasheet material that detail device-level electrical and timing specifications, facilitating integration into high-density, high-performance programmable logic designs.

Request a quote or submit an inquiry to purchase the 5SGXEABN3F45I3N and discuss availability, lead times, and volume pricing.

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