5SGXEABN3F45I3L

The 5SGXEABN3F45I3L is a Stratix V GX field-programmable gate array (FPGA) IC designed for high-density, I/O-rich embedded systems. It provides substantial programmable logic capacity and on-chip memory for complex logic, data buffering, and system integration in industrial environments.

Key attributes include 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 840 user I/O pins in a 1932-ball BGA package. The device is specified for industrial temperature operation and RoHS compliant.

Key Features

• High logic density — 952,000 logic elements to implement large-scale digital designs and multi-function systems.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM suitable for deep buffering, state storage, and local data processing.
• Broad I/O capability — 840 user I/O pins to support high fanout interfaces, parallel buses, and complex board-level connectivity.
• Industrial-grade operation — Rated for an operating temperature range of −40 °C to 100 °C for use in temperature-demanding environments.
• Power and supply — Core voltage supply range from 820 mV to 880 mV to match system power-rail requirements.
• Package and mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45), surface-mount mounting for compact, high-density PCB designs.
• RoHS compliant — Conforms to RoHS requirements for restricted hazardous substances.
• Series-level transceiver capability — Stratix V GX devices are offered with GX transceiver options referenced up to 14.1 Gbps in the device family, enabling high-speed serial communication where applicable.

Typical Applications

• Industrial control and automation — Large logic capacity and industrial temperature rating enable complex control, motion coordination, and real-time processing in factory and process environments.
• Networking and communications — High I/O count and Stratix V GX family transceiver options support dense interface routing and high-speed serial links for network equipment and telecom modules.
• Data processing and acceleration — Substantial logic and embedded memory allow implementation of custom datapaths, packet processing, and hardware acceleration engines.
• Test, measurement, and instrumentation — Flexible I/O and large on-chip resources support multi-channel acquisition, signal processing, and protocol bridging in instrumentation platforms.

Unique Advantages

• Large, integrated programmable fabric: 952,000 logic elements reduce the need for external microcontrollers or ASICs by consolidating multiple functions on a single device.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and local data storage, improving system throughput and latency.
• High I/O density: 840 I/Os simplify board design for systems requiring many external interfaces or parallel connections.
• Industrial temperature rating: −40 °C to 100 °C operation broadens deployment options for rugged and industrial applications.
• Compact high-ball-count package: 1932-BBGA (45×45) gives high routing density in a smaller PCB footprint for space-constrained systems.
• Regulatory readiness: RoHS compliance helps streamline environmental requirements for global product deployment.

Why Choose 5SGXEABN3F45I3L?

The 5SGXEABN3F45I3L positions itself as a high-density, industrial-grade Stratix V GX FPGA for designs that demand extensive programmable logic, abundant embedded memory, and a large number of I/Os. Its package and operating range support compact, robust system implementations where integration and reliability matter.

Engineers targeting networking, industrial automation, data acceleration, or instrumentation will find this device suitable for consolidating functions, reducing BOM count, and enabling scalable designs backed by the Stratix V device family characteristics.

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