5SGXEABN3F45C3N

The 5SGXEABN3F45C3N is a Stratix V GX family Field Programmable Gate Array (FPGA) from Intel, offering very large on-chip logic and memory resources in a high-pin-count FCBGA package. It targets designs that require extensive programmable logic, abundant embedded memory, and large I/O capacity within a commercial temperature operating range.

With 952,000 logic elements and approximately 53 Mbits of embedded memory, this device is suited for complex digital systems that need high integration density and flexible I/O routing while operating at a nominal core voltage between 820 mV and 880 mV.

Key Features

• High Logic Capacity — 952,000 logic elements to implement large-scale, deeply pipelined, or parallel designs.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM to support buffering, large state machines, and local data storage.
• Extensive I/O — 840 I/Os for dense board-level connectivity to peripherals, serializers, and external memory interfaces.
• Package & Mounting — 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45); surface-mount device suitable for compact, high-pin-count boards.
• Low-Voltage Core — Core supply range of 820 mV to 880 mV for operation within the specified power envelope.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general-purpose and enterprise electronics.
• Standards Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-Speed Data Processing & Networking — Large logic capacity and abundant I/O enable packet processing, protocol bridging, and custom network functions.
• Compute Acceleration — Substantive embedded memory and logic resources support hardware acceleration for compute-intensive algorithms and signal processing.
• Board-Level System Integration — High I/O count and dense BGA packaging allow integration of multiple interfaces and peripherals on a single FPGA-based system.

Unique Advantages

• Massive Programmable Logic: 952,000 logic elements provide headroom for complex state machines, large datapaths, and parallel architectures.
• Significant On-Chip Memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
• High I/O Density: 840 I/Os support extensive external interfacing without additional multiplexing or bridging chips.
• Compact, High-Pin Package: 1932-ball FCBGA (45×45 mm) enables high-density designs with efficient board routing.
• Commercial Temperature Rating: Designed for 0 °C to 85 °C operation to serve a wide range of enterprise and general-purpose applications.
• RoHS Compliant: Facilitates environmental and regulatory requirements for global product deployment.

Why Choose 5SGXEABN3F45C3N?

The 5SGXEABN3F45C3N combines very large logic and memory resources with a high I/O count in a dense FCBGA package, making it well suited for demanding FPGA designs that require integration of multiple functions on a single device. Its commercial temperature rating and RoHS compliance align with a broad set of enterprise and general-purpose applications.

Engineers and system architects seeking a high-capacity Stratix V GX device will find this part appropriate for complex digital processing, protocol implementations, and systems that benefit from on-chip memory and extensive external connectivity.

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