5SGXEABN3F45C2LG

The 5SGXEABN3F45C2LG is a Stratix® V GX FPGA IC from Intel, delivered in a 1932-BBGA FCBGA package. It integrates a very large logic capacity and substantial on-chip RAM to support complex, logic- and memory-intensive designs.

With 952,000 logic elements, approximately 53.2 Mbits of embedded memory, and 840 I/Os, this commercial-grade, surface-mount device targets applications that require high functional density, extensive I/O connectivity, and low-voltage core operation.

Key Features

• Core Logic  952,000 logic elements provide large-scale programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support buffering, DSP, and state storage without external memory.
• I/O Capacity  840 user I/Os enable dense interfacing to multiple peripherals, high-pin-count boards, and multi-channel systems.
• Power and Voltage  Core supply specified from 820 mV to 880 mV to match low-voltage system designs and power-optimized deployments.
• Package and Mounting  Supplied in a 1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC 45×45) for high-density PCB integration; surface-mount mounting type.
• Operating Range and Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C, suitable for standard commercial applications.
• Compliance  RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• Complex Digital Systems  Ideal for workloads that need extensive programmable logic and embedded memory to implement large-scale custom logic and control functions.
• High-Density I/O Integration  Suitable for designs requiring many parallel interfaces or multi-channel connectivity, leveraging the 840 I/Os.
• Memory-Intensive Functions  Well suited to applications that require substantial on-chip buffering, packet processing, or local data storage using the device's embedded RAM.
• Prototype and Platform Development  Useful for system prototyping and platform-level integration where a single device must accommodate diverse logic and I/O requirements.

Unique Advantages

• Large Logic Capacity: 952,000 logic elements enable consolidation of complex subsystems into a single device, reducing overall component count.
• Significant On-Chip Memory: Approximately 53.2 Mbits of embedded RAM minimizes reliance on external memory and simplifies board layouts.
• Extensive I/O: 840 I/Os provide flexibility for dense interfacing and multi-channel designs without additional I/O expanders.
• Low-Voltage Core: Core supply range of 0.82 V to 0.88 V supports low-power system architectures and careful power budgeting.
• High-Density Package: 1932-BBGA / 1932-FBGA (45×45) packaging supports compact PCB designs while enabling high pin count.
• Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments and regulatory alignment.

Why Choose 5SGXEABN3F45C2LG?

The 5SGXEABN3F45C2LG combines one of the largest logic capacities available in the Stratix® V GX family with substantial embedded memory and a high I/O count, packaged for dense surface-mount integration. It is positioned for designers who need to implement complex digital logic, extensive interfacing, and on-chip memory without fragmenting the design across multiple devices.

Backed by Intel’s Stratix V device family, this part is suited to commercial applications where integration density, memory depth, and I/O scale are key decision drivers. Its package and electrical characteristics make it appropriate for platform-level designs that prioritize consolidation and deterministic operating conditions.

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