5SGXEABN3F45C2L

The 5SGXEABN3F45C2L is a Stratix V GX series FPGA from Intel, provided as a commercial-grade, surface-mount FCBGA device. It delivers very high logic density combined with substantial on-chip memory and a large I/O count, targeting complex digital designs that require massive parallelism and dense integration.

This device is packaged in a 1932‑BBGA (1932‑FBGA, 45×45) form factor, operates from a core supply of 820 mV to 880 mV, and is rated for commercial operating temperatures (0 °C to 85 °C). The part is RoHS compliant.

Key Features

• High Logic Density — 952,000 logic elements suitable for large-scale, highly parallel custom logic implementations.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM to support buffering, large state machines, and data-path requirements.
• Extensive I/O — 840 user I/O pins to interface with high-pin-count systems, peripherals, and wide bus architectures.
• Package and Mounting — 1932‑BBGA (supplier package: 1932‑FBGA, FC 45×45) in a surface-mount form factor for dense PCB integration.
• Power — Core supply range from 820 mV to 880 mV to align with specified device operating conditions.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Compliance — RoHS compliant for environmental and manufacturing process considerations.

Typical Applications

• High-density digital processing — Large logic capacity and substantial embedded memory enable complex data-paths, signal processing, and algorithm acceleration within a single device.
• Networking and communications — The Stratix V GX family supports transceiver-equipped device grades; the part’s high I/O count and density suit high-throughput interface and packet-processing designs.
• Data-plane and control-plane acceleration — Large logic and memory resources support custom offload engines, lookup tables, and protocol handling for compute and network functions.
• System integration and prototyping — High I/O and dense logic resources enable evaluation platforms and complex system prototypes that consolidate multiple functions on one FPGA.

Unique Advantages

• Massive on-chip resources: 952,000 logic elements and approximately 53 Mbits of embedded memory reduce reliance on external components and simplify board-level design.
• High I/O capacity: 840 I/O pins provide flexibility for wide data buses, parallel interfaces, and multiple peripheral connections.
• Dense BGA packaging: 1932‑BBGA (45×45) enables compact system layouts while accommodating the part’s pin count and thermal considerations.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments and supply-chain planning.
• RoHS compliant: Conforms to environmental standards for modern manufacturing and assembly processes.

Why Choose 5SGXEABN3F45C2L?

The 5SGXEABN3F45C2L positions itself where very high logic capacity, significant embedded memory, and large I/O resources are required in a single commercial-grade FPGA. Its Stratix V GX architecture delivers the raw resources designers need to consolidate complex functions, accelerate data-paths, and implement broad system interfaces without fragmenting the design across multiple devices.

This part is suited for engineering teams and procurement groups targeting high-density digital designs, advanced communication interfaces, and prototype-to-deployment workflows where a dense, surface-mount BGA package and verified electrical characteristics are key selection factors.

Request a quote or submit an inquiry to receive availability, pricing, and procurement details for the 5SGXEABN3F45C2L. Our team can provide the information you need to evaluate this Stratix V GX FPGA for your next design.