5SGXEABN3F45C2G

The 5SGXEABN3F45C2G is a Stratix® V GX field programmable gate array (FPGA) offered in a high-density 1932-BBGA FCBGA package. This commercial-grade device delivers very large logic capacity, substantial on-chip memory, and a high I/O count for complex digital system integration.

Engineered for designs that require extensive programmable logic and memory resources, the device supports surface-mount assembly and operates within a defined commercial temperature and core-voltage window to enable reliable deployment in line-of-business and communications equipment.

Key Features

• Logic Capacity — 952,000 logic elements for large-scale FPGA implementations and complex logic designs.
• Embedded Memory — Approximately 53.2 Mbits of on-chip RAM to support buffering, packet processing, or large lookup tables without external memory.
• I/O Density — 840 user I/Os to accommodate high-pin-count interfaces and dense system routing.
• Package & Mounting — 1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC, 45×45 mm) with surface-mount mounting for compact board-level integration.
• Power — Core supply range of 870 mV to 930 mV, enabling precise core-voltage provisioning in system power architectures.
• Operating Range — Commercial grade operation from 0°C to 85°C, suitable for commercial equipment deployment.
• Environmental Compliance — RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• High-density digital systems — Leverage 952,000 logic elements and large embedded RAM to consolidate complex logic and state machines on a single device.
• Data plane and packet processing — Large on-chip memory and abundant I/O support buffering and high-throughput interface aggregation in network and communications equipment.
• System integration and prototyping — High I/O count and large logic capacity accommodate integration of multiple subsystems and fast prototyping of system-on-chip functions.

Unique Advantages

• Substantial programmable capacity: 952,000 logic elements enable implementation of large, complex designs without immediate reliance on multiple devices.
• Significant on-chip memory: Approximately 53.2 Mbits of embedded RAM reduce dependency on external memory for many buffering and table storage needs.
• High I/O count: 840 I/Os simplify board-level routing for multi-interface systems and reduce the need for external I/O expanders.
• Compact, high-pin package: 1932-BBGA FCBGA in a 45×45 mm footprint provides a high-density solution for space-constrained PCBs.
• Commercial operating window: Specified 0°C to 85°C operation and RoHS compliance support standard commercial deployments and manufacturing flows.
• Defined core-voltage range: 870 mV–930 mV supply specification allows predictable power budgeting and regulator selection.

Why Choose 5SGXEABN3F45C2G?

The 5SGXEABN3F45C2G combines very high logic density, broad on-chip memory, and a large I/O footprint in a single commercial-grade FPGA package. It is positioned for teams designing complex digital systems that require consolidation of multiple functions, extensive buffering, and high interface counts while maintaining a compact board footprint.

For engineering and procurement teams seeking a scalable FPGA platform with well-defined electrical and thermal operating points, this Stratix® V GX device provides predictable integration characteristics and compliance with lead-free manufacturing requirements.

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