5SGXEABN3F45C2LN

The 5SGXEABN3F45C2LN is a Stratix V GX series Field Programmable Gate Array (FPGA) IC optimized for high-density programmable logic designs. This commercial-grade device integrates a very large logic fabric, significant on-chip memory, and a high I/O count in a 1932-ball FCBGA package.

Designed for applications that need large-scale, reconfigurable logic, the device delivers a combination of capacity and I/O integration while operating within a core supply range of 820 mV to 880 mV and a commercial temperature window of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 952,000 logic elements, providing extensive programmable fabric for complex designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for large buffers, state storage, and data-path memory.
• I/O  840 I/O pins to support high channel counts, extensive external interfacing, and parallel connectivity.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package specified as 1932-FBGA, FC (45×45). Surface-mount device suitable for PCB assembly.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail design requirements.
• Temperature Grade  Commercial operating temperature from 0 °C to 85 °C for board- and system-level deployments in commercial environments.
• Regulatory  RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

• High-density digital signal processing  Large logic and memory resources enable implementation of complex DSP pipelines and data-paths.
• Multi-channel I/O systems  High I/O count supports designs that require extensive parallel interfacing, aggregation, or buffering of external signals.
• System prototyping and integration  Substantial logic capacity and embedded RAM provide headroom for prototyping SoC functions and integrating custom logic blocks.
• Packet and data buffering  Embedded memory and I/O density can be used to implement large buffering and queuing structures for high-throughput data handling.

Unique Advantages

• Large programmable fabric  Approximately 952,000 logic elements let you map complex, parallel logic without external ASIC dependency.
• Significant on-chip memory  Approximately 53.25 Mbits of embedded RAM reduces external memory needs for many data-centric functions.
• High I/O integration  840 I/O pins simplify board routing and enable high-channel-count designs without extensive external multiplexing.
• Commercial-grade operating window  Rated for 0 °C to 85 °C to match commercial deployments and product life-cycle expectations.
• Surface-mount, high-density package  1932-ball FCBGA package supports compact board layouts while providing many I/Os and signal pairs.
• RoHS compliant  Supports modern lead-free manufacturing processes and regulatory compliance.

Why Choose 5SGXEABN3F45C2LN?

The 5SGXEABN3F45C2LN offers a high-capacity Stratix V GX FPGA solution tailored for designers requiring substantial programmable logic, embedded memory, and a large number of I/Os within a single commercial-grade device. Its combination of approximately 952,000 logic elements, roughly 53.25 Mbits of on-chip RAM, and 840 I/Os makes it well suited for complex data-paths, multi-channel interfacing, and integration of advanced custom logic at the board level.

For teams focused on scalability and integration, this device provides the resources needed to consolidate functionality, reduce external components, and accelerate development within commercial temperature ranges while adhering to RoHS requirements.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical support for 5SGXEABN3F45C2LN.