5SGXEABN3F45C3G

The 5SGXEABN3F45C3G is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in a 1932-ball FCBGA package. This commercial-grade device delivers a very large logic fabric paired with substantial on-chip memory and a high I/O count, targeting complex digital designs that require dense logic, broad connectivity, and integrated memory resources.

With 952,000 logic elements, approximately 53.25 Mbits of embedded RAM and up to 840 user I/O pins, this device is suited for applications where large-scale programmable logic and extensive I/O routing are required within a surface-mount FCBGA form factor.

Key Features

• Core Logic Capacity — 952,000 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local storage to support data-intensive tasks.
• I/O Resources — Up to 840 user I/O pins enabling extensive external interfacing and high connector density for system integration.
• Power Supply — Core supply range from 820 mV to 880 mV, allowing designers to plan power delivery for the FPGA core precisely.
• Package & Mounting — 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) in a surface-mount configuration for standard PCB assembly processes.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial-environment deployments.
• RoHS Compliant — Device meets RoHS requirements for restricted substances.

Typical Applications

• High-density digital signal processing — Implement large DSP pipelines and parallel processing architectures using the device’s extensive logic elements and embedded RAM.
• Telecommunications and networking — Support complex packet processing, wide I/O interfacing, and protocol handling leveraging up to 840 user I/O pins.
• Data center acceleration and compute — Deploy custom accelerators and hardware offload engines that require substantial on-chip logic and memory resources.
• Prototype and verification platforms — Use the large programmable fabric to prototype multicore and system-level designs prior to ASIC implementation.

Unique Advantages

• Massive programmable capacity: 952,000 logic elements provide headroom for large, complex designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O availability: 840 I/O pins simplify interface routing and enable direct connections to numerous peripherals and front-end modules.
• Compact FCBGA packaging: 1932-ball FCBGA offers a high-density, surface-mount solution suitable for space-constrained PCBs while supporting substantial I/O and routing.
• Commercial operating range: Rated for 0 °C to 85 °C, aligning the device with a broad set of standard commercial deployments.
• Standards-conscious supply: RoHS compliance supports environmental and materials planning for product builds.

Why Choose 5SGXEABN3F45C3G?

The 5SGXEABN3F45C3G combines nearly one million logic elements, large embedded memory, and extensive I/O in a single Stratix V GX FCBGA package—providing a consolidated platform for implementing large-scale programmable systems. Its commercial-grade rating and defined core voltage range make it suitable for demanding commercial electronics where predictable electrical and thermal planning is required.

This device is well-suited for engineering teams and system architects building high-capacity FPGA-based solutions that need dense logic, substantial on-chip memory, and broad interfacing options while retaining the benefits of a surface-mount FCBGA package and RoHS compliance.

Request a quote or submit a purchasing inquiry to evaluate availability, lead times, and volume pricing for the 5SGXEABN3F45C3G. Our team can provide additional technical documentation and ordering information to support your design and procurement process.