5SGXEABN3F45I3G

The 5SGXEABN3F45I3G is a Stratix® V GX field‑programmable gate array (FPGA) IC from Intel, offered in a 1932‑ball FCBGA package. This device provides a high-density programmable fabric with 952,000 logic elements and substantial on‑chip memory, designed for demanding embedded and system‑level designs.

With up to 840 user I/O and a core supply window of 820 mV to 880 mV, the device targets applications that require large logic capacity, significant embedded memory, and robust I/O integration while meeting industrial temperature requirements.

Key Features

• Core Logic — 952,000 logic elements supporting complex, high‑density designs and extensive custom logic implementation.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM (53,248,000 bits) to support large buffering, on‑chip data structures, and memory‑intensive algorithms.
• I/O Capacity — 840 user I/O pins to accommodate broad peripheral connectivity and high pin‑count interfaces.
• Package & Mounting — 1932‑BBGA (FCBGA) supplier package 1932‑FBGA, FC (45×45), delivered in a surface‑mount form factor for board‑level integration.
• Power — Core supply voltage range 820 mV to 880 mV, enabling operation within defined low‑voltage parameters.
• Temperature & Grade — Industrial grade device rated for operation from –40 °C to 100 °C, suitable for industrial temperature environments.
• Regulatory Status — RoHS compliant.

Typical Applications

• High‑density signal processing — Large logic capacity and on‑chip RAM enable complex DSP, real‑time processing, and custom accelerator functions.
• Networking and packet processing — High I/O count and dense logic fabric support implementations of packet engines, switch fabrics, and protocol offload.
• Industrial control and automation — Industrial temperature rating and broad I/O make the device suitable for control systems, motor control front‑ends, and factory automation logic.
• Imaging and sensor systems — Embedded memory and massive logic resources help implement image pipelines, sensor fusion, and preprocessing algorithms.

Unique Advantages

• Massive programmable logic: 952,000 logic elements provide headroom for large, complex designs and multi‑function SoC implementations without external logic.
• Significant on‑chip RAM: Approximately 53.25 Mbits of embedded memory reduces reliance on external memory for buffering and state storage, simplifying system design.
• Extensive I/O integration: 840 user I/O pins support multiple high‑pin interfaces and complex board routing requirements.
• Industrial temperature capability: Rated for –40 °C to 100 °C operation to meet a wide range of industrial deployment conditions.
• Compact FCBGA package: 1932‑BBGA (45×45) FCBGA provides a high‑density package option for space‑constrained systems while preserving signal count.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXEABN3F45I3G?

The 5SGXEABN3F45I3G combines a high logic element count, substantial embedded RAM, and a large I/O complement in a 1932‑ball FCBGA package, delivering a scalable platform for complex, memory‑intensive designs. Its industrial temperature rating and defined core voltage range make it suitable for production systems that require stability across a broad operating envelope.

This Stratix V GX device is well suited to engineering teams designing high‑density FPGA solutions that demand integrated memory, wide I/O capability, and the physical integration afforded by a compact FCBGA package. Designers can rely on documented device characteristics and datasheet guidance for electrical and switching behavior during system development.

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