5SGXEABN3F45I3LN

The 5SGXEABN3F45I3LN is an Intel Stratix® V GX field-programmable gate array (FPGA) IC delivering very high logic density and on-chip memory for complex, programmable digital designs. This industrial-grade device combines 952,000 logic elements with substantial embedded RAM and a large I/O count to address dense, memory‑intensive and high‑connectivity applications.

Designed for surface-mount assembly in a 1932‑ball BGA (FCBGA) package and rated for industrial temperatures, the device targets system designs that require high integration, flexible programmability, and robust thermal/voltage operating windows.

Key Features

• Core capacity  952,000 logic elements (logic cells) to support large-scale, highly parallel logic implementations.
• On-chip memory  Approximately 53.25 Mbits of embedded RAM for buffering, caching, and local data storage without external memory dependence.
• I/O density  840 I/O pins to enable dense interfacing, multi-channel connectivity, and complex board-level integration.
• Power and core voltage  Core supply range of 820 mV to 880 mV to match low-voltage FPGA system designs.
• Package and mounting  1932‑BBGA (FCBGA) surface-mount package, supplier package listed as 1932‑FBGA, FC (45×45), for high ball-count, compact board layout.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Manufacturer and family  Part of the Intel Stratix® V GX family, with device electrical and switching characteristics documented in the Stratix V device datasheet.

Typical Applications

• High-density logic processing  Large-scale algorithm acceleration and custom compute pipelines that require hundreds of thousands of logic elements for parallel processing.
• Memory‑intensive designs  Systems that need substantial on-chip buffering and local data storage, leveraging approximately 53.25 Mbits of embedded RAM to reduce external memory bandwidth needs.
• Multi‑interface platforms  Boards and systems with many peripheral and protocol interfaces that benefit from the device’s 840 I/O pins for flexible connectivity and signal routing.
• Industrial systems  Control, instrumentation, and communications equipment that require an industrial temperature range (−40 °C to 100 °C) and surface-mount BGA packaging for compact, robust designs.

Unique Advantages

• High integration density: 952,000 logic elements reduce the need for multiple FPGAs or discrete logic, simplifying system architecture.
• Substantial on‑chip RAM: Approximately 53.25 Mbits of embedded memory supports large data buffers and local storage, improving throughput and latency for memory‑centric functions.
• Extensive I/O capability: 840 I/O pins enable simultaneous connectivity to numerous interfaces and peripherals, reducing external multiplexing complexity.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in demanding thermal environments.
• Low-voltage core: 0.82–0.88 V core supply aligns with modern low-voltage FPGA ecosystems and power-management strategies.
• Compact high-ball-count package: 1932‑BBGA (FCBGA) provides a space-efficient solution for high-pin-count FPGA integration on densely populated PCBs.

Why Choose 5SGXEABN3F45I3LN?

This Intel Stratix® V GX FPGA is positioned for designs that demand very high logic capacity, significant embedded memory, and a large number of I/Os within an industrial temperature envelope. Its combination of near‑million logic elements, tens of megabits of on‑chip RAM, and a 1932‑ball FCBGA package makes it suitable for complex signal processing, protocol bridging, and high‑throughput acceleration tasks.

Engineers and procurement teams selecting 5SGXEABN3F45I3LN can rely on a solution that consolidates functionality, supports dense connectivity, and is specified for industrial operating conditions—providing a scalable platform for long‑lifecycle, high‑performance FPGA implementations.

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