5SGXEABN3F45I4G

The 5SGXEABN3F45I4G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 1932‑ball FCBGA package. This industrial‑grade, surface‑mount device provides a large logic fabric and significant on‑chip memory for high‑density FPGA designs.

Key hardware attributes include 952,000 logic elements, approximately 53 Mbits of embedded RAM, 840 user I/O pins, and a specified core voltage range of 820 mV to 880 mV. The device is rated for operation from −40 °C to 100 °C and is RoHS compliant.

Key Features

• Core Logic  Provides 952,000 logic elements suitable for large, complex digital designs and extensive FPGA implementations.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM to support data buffering, lookup tables, and state storage within the device.
• I/O Density & Package  840 user I/O pins in a 1932‑BBGA (1932‑FBGA, FC 45×45) FCBGA package for high pin‑count connectivity in a compact surface‑mount form factor.
• Power  Core voltage supply specified between 820 mV and 880 mV to meet platform power requirements.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Mounting & Compliance  Surface mount device with RoHS compliance for compatibility with modern PCB assembly and environmental requirements.

Typical Applications

• High‑density digital systems  Implements complex logic and large FPGA designs that require hundreds of thousands of logic elements.
• I/O‑intensive interfaces  Supports designs that need many external connections or parallel interfaces through 840 user I/O pins.
• Embedded memory‑centric designs  Leverages approximately 53 Mbits of on‑chip RAM for buffering, packet processing, or state storage without immediate external memory dependency.
• Industrial systems  Suitable for applications requiring industrial temperature operation (−40 °C to 100 °C) and robust surface‑mount packaging.

Unique Advantages

• Large logic capacity: 952,000 logic elements enable integration of complex functions and high gate counts on a single device, reducing board‑level partitioning.
• Significant embedded memory: Approximately 53 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and storage tasks.
• High I/O count in FCBGA: 840 I/O in a 1932‑ball FCBGA package delivers dense external connectivity while preserving a compact PCB footprint.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in temperature‑extreme environments.
• Controlled core voltage range: Defined 820–880 mV supply window supports predictable power budgeting and system design.
• RoHS compliance: Meets environmental directives for lead‑free assembly and regulatory considerations.

Why Choose 5SGXEABN3F45I4G?

The 5SGXEABN3F45I4G positions itself as a high‑density Stratix V GX FPGA option for engineers and teams needing substantial logic capacity, considerable on‑chip RAM, and a large number of I/O in a single surface‑mount FCBGA package. Its industrial temperature rating and defined core voltage range support deployment in demanding environments where thermal and power characteristics must be controlled.

Designed within Intel’s Stratix V family, the device offers the specification set required for complex FPGA implementations where integration density, I/O count, and embedded memory are primary design drivers.

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