5SGXEABN3F45C4N

The 5SGXEABN3F45C4N is a Stratix® V GX field-programmable gate array (FPGA) from Intel (Altera), provided in a 1932‑FBGA package. This commercial‑grade FPGA delivers very high logic density and on‑chip memory capacity for designs that require large programmable fabric, extensive I/O, and compact surface‑mount packaging.

With 952,000 logic elements, approximately 53.25 Mbits of embedded memory and 840 user I/O pins, the device targets high‑complexity systems where integration density, routing capacity and memory resources are primary design drivers.

Key Features

• Core Logic — 952,000 logic elements providing extensive programmable fabric for complex combinational and sequential logic implementation.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM to support large buffering, state storage and FPGA‑resident data structures.
• I/O Density — 840 user I/O pins to support wide parallel interfaces, multiple high‑pin‑count peripherals and dense board interconnects.
• Power Supply — Core supply specified from 820 mV to 880 mV, enabling明确 core voltage planning for power and thermal budgets.
• Package & Mounting — Surface‑mount 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45), suitable for compact, high‑density PCB designs.
• Operating Temperature — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial deployments.
• Standards Compliance — RoHS compliant.

Typical Applications

• High‑density compute acceleration — Use the large logic and embedded memory resources to implement acceleration kernels and custom datapaths directly in programmable logic.
• Packet processing and networking — Leverage 840 I/Os and high logic density to build complex packet engines, classifiers and protocol offload functions.
• Video and image processing — Implement multi‑stage pipelines, frame buffering and parallel pixel processing using abundant logic and on‑chip RAM.
• Test and measurement systems — Support dense I/O connectivity and real‑time data handling for instrumentation, capture and preprocessing applications.

Unique Advantages

• Extensive programmable fabric: 952,000 logic elements enable very large custom logic implementations without external glue logic.
• Large embedded memory: Approximately 53.25 Mbits of on‑chip RAM reduces dependence on external memory for buffering and state retention.
• High I/O count: 840 I/Os simplify system routing and support multiple parallel interfaces on a single device.
• Compact, board‑friendly package: 1932‑FBGA (45×45) surface‑mount package provides a high‑density footprint for space‑constrained PCBs.
• Commercial temperature rating: 0 °C to 85 °C specification aligns with a broad range of standard commercial electronic products.
• Regulatory friendliness: RoHS compliance supports environmental and manufacturing requirements for many global supply chains.

Why Choose 5SGXEABN3F45C4N?

The 5SGXEABN3F45C4N combines very high logic capacity, substantial on‑chip memory and a large I/O complement in a compact surface‑mount FCBGA package, making it a strong choice for designers needing densely integrated programmable solutions. Its commercial temperature rating and RoHS compliance simplify deployment in mainstream electronic products where performance, integration and supply‑chain compatibility matter.

This device is suited to teams building complex FPGA‑centric systems—where scalability of logic, memory footprint, and I/O count reduce external components and shorten system integration time—backed by Intel (Altera) device documentation and ecosystem support.

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