5SGXEABN3F45C4G

The 5SGXEABN3F45C4G is an Intel Stratix V GX field programmable gate array (FPGA) in a 1932-ball FCBGA package. It delivers very large logic capacity and on-chip memory suitable for dense commercial designs that require high I/O counts and significant embedded RAM.

Designed for commercial temperature operation, this device targets applications that benefit from high logic density, extensive embedded memory, and broad I/O connectivity while operating within a low core-voltage range.

Key Features

• Logic Capacity — 952,000 logic elements to implement large, complex designs and deep processing pipelines.
• Embedded Memory — Approximately 53.2 Mbits of on-chip RAM to support buffering, packet processing, and on-chip data structures.
• I/O Density — 840 I/O pins for extensive external interfacing and high channel counts.
• Package — 1932-ball BGA (FCBGA) / supplier package 1932-FBGA, FC (45×45) for high pin-count, board-level integration.
• Power and Voltage — Core supply range of 820 mV to 880 mV, enabling predictable core-power planning for system design.
• Thermal and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C, meeting typical commercial electronics requirements.
• Mounting — Surface mount device for standard PCB assembly processes.
• RoHS Compliance — RoHS-compliant construction for regulatory and environmental compatibility.

Typical Applications

• High-density logic platforms — Implements complex state machines, parallel processing engines, and large custom logic blocks using the device’s 952,000 logic elements.
• On-chip buffering and packet handling — Leverages approximately 53.2 Mbits of embedded RAM to support high-throughput buffering, queues, and temporary storage on-chip.
• Multi-channel interfacing — Uses 840 I/Os for connecting to numerous peripherals, mezzanine modules, or parallel data buses in communication and embedded systems.

Unique Advantages

• Extensive logic density: 952,000 logic elements provide the headroom for complex, large-scale FPGA implementations without partitioning across devices.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful functions.
• High I/O count: 840 I/O pins enable broad external connectivity and simplify routing for multi-channel designs.
• High-pin-count BGA package: The 1932-ball FCBGA (45×45) package supports dense board-level integration and high signal routing capacity.
• Commercial temperature suitability: Rated for 0 °C to 85 °C to align with standard commercial product deployment environments.
• Regulatory readiness: RoHS compliance simplifies environmental qualification for commercial products.

Why Choose 5SGXEABN3F45C4G?

The 5SGXEABN3F45C4G positions itself as a high-capacity Stratix V GX FPGA option for commercial designs that require large logic resources, significant embedded memory, and a very high I/O count. Its FCBGA package and defined core-voltage range support predictable system integration and power planning.

This device is appropriate for teams building dense, performance-oriented FPGA systems where on-chip resources and I/O density reduce external components and simplify board-level design. Backed by Intel’s Stratix V family datasheet guidance, it is a scalable choice for complex commercial FPGA implementations.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXEABN3F45C4G.