5SGXEABN3F45C2N

The 5SGXEABN3F45C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic density and on-chip memory in a fully programmable fabric suitable for complex digital designs that require large amounts of embedded memory and extensive I/O.

With 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/Os in a 1932-BBGA FCBGA package, this device targets high-density, I/O-rich applications where integration and scalability are priorities.

Key Features

• Core Logic Density  952,000 logic elements capable of implementing large-scale digital logic and complex state machines.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms.
• I/O Capacity  840 general-purpose I/Os for broad interfacing options with peripherals, sensors, and high-pin-count systems.
• Package & Mounting  Supplier device package: 1932-FBGA, FC (45×45); package case: 1932-BBGA, FCBGA; surface-mount mounting type for compact board-level integration.
• Power  Core voltage supply range: 870 mV to 930 mV for the device core power domain.
• Temperature & Grade  Commercial grade device with operating temperature range from 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Manufacturer  Intel (Stratix V family) — backed by device datasheet documentation covering electrical and switching characteristics.

Typical Applications

• High-density digital processing  Large logic element count and substantial embedded RAM make this FPGA suitable for complex digital signal processing and compute-intensive functions.
• I/O-intensive system integration  With 840 I/Os, the device is well-suited for designs that require extensive external connectivity and parallel interfaces.
• Memory-rich buffering and packet processing  Approximately 53.25 Mbits of on-chip RAM supports buffering, look-up tables, and mid-sized data storage tasks within the FPGA fabric.
• Compact board-level deployment  The 1932-BBGA/FCBGA package and surface-mount mounting enable dense PCB layouts for space-constrained systems.

Unique Advantages

• High logic capacity: 952,000 logic elements provide the scale to consolidate multiple functions into a single FPGA, reducing system complexity.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful tasks.
• Extensive I/O count: 840 I/Os enable wide parallel connectivity and flexible interfacing to a variety of external systems and components.
• Compact FCBGA footprint: 1932-ball BGA packaging supports high pin-count integration in a compact board area.
• Commercial operating range: Rated for 0 °C to 85 °C to match a broad set of commercial applications and deployment environments.
• RoHS compliant and manufacturer backed: RoHS compliance and Intel Stratix V family documentation support compliance and design validation.

Why Choose 5SGXEABN3F45C2N?

The 5SGXEABN3F45C2N positions itself as a high-density, memory-rich Stratix V GX FPGA that combines nearly one million logic elements with substantial embedded RAM and a very large I/O count. Its package and power envelope enable integration into compact, high-performance designs where on-chip resources and extensive connectivity matter.

This device is suitable for designers and teams building I/O-heavy or compute-dense systems who require a commercially graded FPGA backed by Intel's Stratix V documentation. The combination of core density, embedded memory, and package options delivers a scalable foundation for system-level integration and long-term design stability.

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