5SGXEB5R3F43I3G

The 5SGXEB5R3F43I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a high-density programmable fabric with 490,000 logic elements and approximately 42 Mbits of on-chip RAM in a 1760-pin FCBGA package.

Designed for applications that require large logic capacity and extensive I/O, this device is offered in an industrial temperature grade and supports surface-mount deployment in a 1760-FCBGA (42.5×42.5 mm) package. The device operates with a supply voltage range of 820 mV to 880 mV and an operating temperature range of –40°C to 100°C.

Key Features

• Core Logic 490,000 logic elements for large, complex FPGA designs.
• Embedded Memory Approximately 42 Mbits of on-chip RAM to support buffering, deep FIFOs, and local data storage.
• I/O Density & Package 600 I/O pins in a 1760-BBGA / 1760-FCBGA surface-mount package (42.5×42.5 mm) for high-pin-count system integration.
• Power Supply Range Voltage supply specified from 820 mV to 880 mV to match platform core power requirements.
• Industrial Temperature Grade Rated for operation from –40°C to 100°C for deployment in extended-temperature environments.
• RoHS Compliance RoHS-compliant manufacturing status.

Typical Applications

• High-density processing — Large logic element count and significant on-chip RAM make the device suitable for complex programmable logic tasks and accelerator functions.
• High I/O systems — 600 I/O pins and a high-pin-count FCBGA package enable integration with dense connector and mezzanine interfaces.
• Industrial and extended-temperature systems — Industrial-grade temperature range supports deployment where extended thermal tolerance is required.

Unique Advantages

• Large logic capacity: 490,000 logic elements provide the headroom required for complex implementations, reducing the need for multiple devices.
• Substantial embedded memory: Approximately 42 Mbits of on-chip RAM supports local buffering and state storage, improving system throughput and latency.
• Extensive I/O and compact footprint: 600 I/Os in a 1760-FCBGA (42.5×42.5 mm) package allow high connectivity while keeping board area predictable.
• Industrial-grade operation: Specified for –40°C to 100°C operation to meet extended-environment requirements.
• Controlled core supply range: 820–880 mV supply ensures compatibility with low-voltage core power domains.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing flows.

Why Choose 5SGXEB5R3F43I3G?

The 5SGXEB5R3F43I3G combines high logic density, significant embedded memory, and a large I/O complement in a surface-mount 1760-FCBGA package, offering a balanced platform for designs that require scalable programmable logic and extensive connectivity. Its industrial temperature rating and defined core supply range provide practical deployment characteristics for systems operating outside commercial temperature ranges.

This device is appropriate for engineering teams and procurement seeking a high-capacity Stratix V GX FPGA from Intel with clear, verifiable specifications for logic elements, embedded RAM, I/O count, package, power, and operating temperature.

Request a quote or submit an inquiry to begin procurement or to evaluate the 5SGXEB5R3F43I3G for your next design.