5SGXEB5R3F43I3N

The 5SGXEB5R3F43I3N is a Stratix V GX Field Programmable Gate Array from Intel, offered in an industrial temperature grade. This high-density FPGA provides a large array of programmable logic, significant on-chip memory, and a high I/O count suitable for demanding, space-constrained board designs.

Key value propositions include substantial logic capacity and embedded memory combined with a 1760-FCBGA package and an industrial operating range, delivering a platform for complex, reprogrammable digital systems.

Key Features

• Logic Capacity  Approximately 490,000 logic elements for implementing large, complex custom logic designs.
• Embedded Memory  Approximately 42 Mbits of embedded memory to support data buffering, state storage, and on-chip data structures.
• I/O Resources  600 I/O pins to support broad external connectivity and interfacing options on dense systems.
• Power Supply  Device voltage supply range of 820 mV to 880 mV, allowing precise core-voltage budgeting in system power design.
• Package & Mounting  1760-FCBGA (1760-BBGA) surface-mount package with a 42.5 × 42.5 mm supplier device footprint for compact board integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control  Industrial-grade temperature rating and large I/O count enable complex control and automation systems operating across wide temperature ranges.
• High-density Digital Logic  Approximately 490,000 logic elements allow integration of large, custom digital functions on a single device.
• Memory-intensive FPGA Designs  Approximately 42 Mbits of on-chip memory supports buffering and data-path implementations that rely on embedded RAM.

Unique Advantages

• High Logic Integration: The device’s ~490k logic elements reduce the need for multiple FPGAs by consolidating complex functions into one package.
• Substantial On-chip Memory: Approximately 42 Mbits of embedded memory enables efficient local data storage and lower external memory dependence.
• Extensive I/O Count: 600 I/O provides flexibility for connecting to numerous peripherals, sensors, or high-density backplane interfaces.
• Industrial-ready Operation: Rated for −40 °C to 100 °C operation, supporting deployments in harsher thermal environments.
• Compact, Surface-mount Package: 1760-FCBGA (42.5 × 42.5 mm) footprint optimizes board area while supporting high pin counts.
• Regulatory Compliance: RoHS compliance facilitates use in lead-free manufacturing processes.

Why Choose 5SGXEB5R3F43I3N?

The 5SGXEB5R3F43I3N positions itself as a high-capacity Stratix V GX FPGA option for designs that require significant programmable logic, on-chip memory, and extensive I/O in an industrial temperature-rated package. Its combination of dense logic resources, substantial embedded RAM, and a 1760-FCBGA surface-mount package makes it well suited to complex digital systems where board space and thermal robustness matter.

Choosing this FPGA provides a scalable hardware platform for engineers and procurement teams who need verifiable specifications—logic density, memory size, I/O count, supply voltage range, package dimensions, and operating temperature—to plan system architecture, thermal design, and supply-chain decisions with confidence.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the 5SGXEB5R3F43I3N Stratix V GX FPGA.