5SGXEB5R3F43I3LN

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 1,147 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXEB5R3F43I3LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEB5R3F43I3LN is an industrial-grade Stratix V GX FPGA device offering high logic capacity and extensive I/O for complex digital designs. Built on the Stratix V GX family architecture, this device targets systems that require large programmable logic resources, significant embedded memory, and broad I/O integration.

Key value comes from its large resource set—490,000 logic elements, approximately 42 Mbits of embedded memory, and 600 I/Os—combined with an industrial operating temperature range and a compact 1760‑FCBGA package for surface-mount assembly.

Key Features

  • Logic Capacity  490,000 logic elements and 185,000 LABs provide extensive programmable fabric for complex RTL, custom accelerators, and large state machines.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM to support deep buffering, large FIFOs, and in‑FPGA data storage without external memory for many tasks.
  • I/O Resources  600 I/Os enable dense board-level integration, wide parallel buses, and multiple external interface connections.
  • Power and Core Voltage  Specified core supply range from 820 mV to 880 mV to match system power-rail planning and regulator selection.
  • Package and Mounting  1760‑FCBGA (42.5 × 42.5 mm) package in a 1760‑BBGA footprint for surface-mount assembly, optimizing board area for high-density systems.
  • Temperature Grade  Industrial operating range from –40 °C to 100 °C for deployment in temperature-challenging environments.
  • Environmental Compliance  RoHS compliant to meet common regulatory and assembly requirements.
  • Series-Level Transceiver Capability  Stratix V GX devices in the series document transceiver speed grades up to 14.1 Gbps (see device datasheet for series-level details).

Typical Applications

  • High‑Performance Networking  Use the device’s large logic fabric and series-level transceiver capabilities for packet processing, protocol offload, and high-bandwidth switching elements.
  • Signal Processing and Acceleration  Large numbers of logic elements and embedded memory support DSP blocks, custom accelerators, and data-path pipelines for compute‑intensive tasks.
  • Industrial Control and Automation  Industrial temperature rating and extensive I/O make the device suitable for robust control systems, machine vision pre‑processing, and deterministic I/O orchestration.
  • Prototyping and System Integration  High resource counts and dense packaging enable consolidation of multiple functions into a single FPGA for rapid prototyping and reduced BOM.

Unique Advantages

  • Substantial Logic and Memory in One Device: 490,000 logic elements and ~42 Mbits of embedded RAM reduce the need for external logic and memory chips, simplifying board design.
  • High I/O Density: 600 I/Os support complex interfacing and parallel data paths without extensive external multiplexing.
  • Industrial Reliability: Rated for –40 °C to 100 °C operation, enabling deployment in temperature-variable industrial environments.
  • Compact, High‑Pin Package: 1760‑FCBGA (42.5 × 42.5 mm) provides high pin count in a compact surface-mount footprint for dense system designs.
  • Power-rail Predictability: A defined core voltage range (820–880 mV) aids regulator selection and power budgeting in system design.
  • Standards‑aware Manufacturing: RoHS compliance streamlines integration into contemporary manufacturing flows.

Why Choose 5SGXEB5R3F43I3LN?

The 5SGXEB5R3F43I3LN combines very large programmable logic resources, substantial on‑chip memory, and high I/O count in a single industrial‑grade Stratix V GX device. Its electrical and thermal specifications support demanding embedded, communications, and industrial applications that require integrating multiple functions into one FPGA.

This device is suited to engineering teams designing high-performance, space-optimized systems that need scalable logic capacity, predictable core voltage characteristics, and wide operating temperature tolerance. Choosing this Stratix V GX part helps reduce component count while providing the on-chip resources needed for complex system functions.

Request a quote or submit an inquiry to get pricing, availability, and supporting documentation for 5SGXEB5R3F43I3LN.

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