5SGXEB5R3F43I4G

The 5SGXEB5R3F43I4G is an Intel Stratix V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It delivers very high logic capacity and on‑chip embedded memory alongside a large I/O count, packaged in a 1760‑FCPGA format for space‑efficient board integration. This device is designed for demanding designs that require dense programmable logic, substantial embedded RAM, and extensive I/O resources.

Key Features

• Logic Capacity  Provides 490,000 logic elements suitable for high-density, complex FPGA designs and large custom logic implementations.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM to support buffering, large state machines, and memory‑intensive algorithms.
• I/O Resources  600 user I/O pins enable extensive external interfacing, parallel buses, and multi‑lane connectivity.
• Package  1760‑FBGA (1760‑FCBGA / 42.5 × 42.5 mm) that supports compact board layouts while providing high pin count accessibility.
• Power Supply  Core voltage range specified at 820 mV to 880 mV to match platform power delivery requirements.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet extended temperature system requirements.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑density logic designs  Large FPGA implementations that require hundreds of thousands of logic elements and significant on‑chip RAM.
• I/O‑intensive systems  Systems requiring extensive peripheral or parallel interfacing using up to 600 I/O pins.
• Embedded memory‑centric functions  Applications that rely on substantial on‑chip RAM for buffering, lookup tables, or data processing.
• Industrial equipment  Deployments that benefit from the device’s industrial temperature rating for reliable operation across wide thermal ranges.

Unique Advantages

• High logic density: The 490,000 logic elements give designers the headroom to implement large, complex logic or multiple concurrent subsystems in a single device.
• Significant on‑chip memory: Approximately 42 Mbits of embedded RAM reduces dependency on external memory for many buffering and state‑storage tasks.
• Extensive I/O capability: 600 I/O pins enable broad external connectivity options, simplifying integration with peripherals and high‑pin‑count interfaces.
• Industrial thermal range: Rated from –40 °C to 100 °C to support deployments in thermally challenging environments.
• Compact, high‑pin package: The 1760‑FCBGA (42.5 × 42.5 mm) package balances high pin count with a space‑efficient footprint for dense board designs.
• Controlled core voltage: Specified 820 mV–880 mV supply range supports predictable power planning for high‑performance FPGA systems.

Why Choose 5SGXEB5R3F43I4G?

The 5SGXEB5R3F43I4G Stratix V GX FPGA combines very large logic capacity, substantial embedded RAM, and a high I/O count in a single industrial‑grade package. It is well suited to design teams needing to consolidate complex digital functions onto one FPGA while maintaining headroom for future design growth.

With a compact 1760‑FCBGA package and defined core voltage and temperature ranges, this device supports robust board integration and predictable system planning for industrial applications and other environments requiring extended temperature operation.

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