5SGXEB5R3F43I4N

The 5SGXEB5R3F43I4N is an Intel Stratix V GX Field Programmable Gate Array (FPGA) supplied in a 1760‑ball FCBGA package (42.5×42.5 mm). It provides a high-density programmable-logic platform with substantial embedded memory and a large I/O count for designs that require extensive logic, on-chip storage, and dense external connectivity.

Provided in an industrial temperature grade with a wide operating range and a low-voltage core supply window, this device targets applications where robust operation across temperature and high integration are required.

Key Features

• Core density  Approximately 490,000 logic elements, enabling large-scale programmable logic implementations and complex custom architectures.
• Embedded memory  Approximately 42 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive logic without external memory for many use cases.
• I/O capacity  600 user I/O pins to accommodate high pin-count interfaces and dense board-level connectivity.
• Power and supply  Core voltage supply specified from 820 mV–880 mV to match low-voltage core domains.
• Package and mounting  1760‑BBGA (FCBGA) surface-mount package, supplier package 1760‑FCBGA (42.5×42.5 mm) for high-pin-count board designs.
• Industrial temperature grade  Rated for operation from −40°C to 100°C for deployment in temperature-variable environments.

Typical Applications

• High-density logic systems  Implement large custom datapaths and control logic using the device's nearly 490k logic elements.
• Memory-centric designs  Leverage approximately 42 Mbits of embedded RAM for buffering, packet handling, or temporary storage inside the FPGA fabric.
• High I/O interfacing  Use the 600 I/O pins for multi-channel data acquisition, board-level aggregation, or complex peripheral interfacing.

Unique Advantages

• High programmable capacity: The large logic element count supports complex, multi-function implementations on a single device.
• Substantial on-chip RAM: Approximately 42 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Extensive external connectivity: 600 I/O pins provide the pin budget required for dense system integration and multiple parallel interfaces.
• Industrial robustness: Industrial temperature operation from −40°C to 100°C supports deployment in demanding environmental conditions.
• Compact, high‑pin package: The 1760‑FCBGA (42.5×42.5 mm) surface-mount package delivers high I/O and logic density in a board-friendly form factor.
• Low-voltage core operation: Core supply specified at 820 mV–880 mV for compatibility with low-voltage power domains.

Why Choose 5SGXEB5R3F43I4N?

The 5SGXEB5R3F43I4N positions itself as a high-density Stratix V GX FPGA option for designs that need a large logic fabric, significant on-chip RAM, and a high I/O count in an industrial-grade package. Its combination of approximately 490,000 logic elements, roughly 42 Mbits of embedded memory, and 600 I/Os makes it well suited for complex, integrated systems where minimizing external components and maximizing on-chip resources are priorities.

Engineers and procurement teams seeking a robust FPGA for industrial-temperature applications will find this device useful where board-level integration, pin density, and on-chip memory reduce BOM complexity and support scalable development.

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