5SGXMA4H2F35C2NCV

The 5SGXMA4H2F35C2NCV is a Stratix® V GX field‑programmable gate array (FPGA) from Intel, offered in a commercial temperature grade. It delivers high logic capacity and substantial on‑chip memory in a high‑pin‑count FCBGA package, enabling dense digital integration on surface‑mount PCBs.

Key attributes include 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and 600 user I/Os—making this device suitable for designs that require large programmable logic resources and extensive external interfacing while operating within a commercial temperature range.

Key Features

• Core Logic  420,000 logic elements for complex digital designs and large‑scale integration.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive functions.
• I/O Count  600 available I/Os for dense board‑level connectivity and multiple parallel interfaces.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact system designs.
• Power  Core supply voltage range: 870 mV to 930 mV, enabling defined power budgeting during system design.
• Operating Range  Commercial temperature grade: 0 °C to 85 °C for typical commercial environments.
• Compliance  RoHS‑compliant to support regulatory and environmental requirements.
• Manufacturer  Designed and supplied by Intel as part of the Stratix V GX family (refer to official Stratix V documentation for family‑level electrical and switching characteristics).

Typical Applications

• Complex digital integration  Use the 420,000 logic elements for large finite‑state machines, custom datapaths, and system consolidation tasks.
• Memory‑intensive functions  Approximately 37.9 Mbits of embedded RAM supports buffering, packet/stream storage, and on‑chip data structures.
• High‑pin‑count board designs  600 I/Os enable multiple external interfaces, parallel buses, and dense peripheral connectivity.

Unique Advantages

• High logic density: 420,000 logic elements allow designers to implement large, integrated systems in a single device, reducing component count.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM minimizes dependence on external memory for many buffering and state‑storage needs.
• Extensive I/O capability: 600 user I/Os provide flexibility for multi‑channel interfaces and complex board routing.
• Compact, high‑pin package: 1152‑FBGA (35×35) packaging delivers high signal density in a surface‑mount footprint suitable for modern PCBs.
• Defined power envelope: Core voltage range of 870 mV–930 mV assists in predictable power supply design and system power budgeting.
• Commercial grade and RoHS compliant: Suitable for commercial applications and conforms to RoHS environmental requirements.

Why Choose 5SGXMA4H2F35C2NCV?

The 5SGXMA4H2F35C2NCV positions itself as a high‑capacity Stratix V GX FPGA option for commercial designs that need substantial programmable logic, abundant on‑chip RAM, and a large number of I/Os in a compact FCBGA package. Its specified core voltage range and commercial operating temperature make it suitable for many board‑level applications where defined electrical and thermal envelopes are required.

Backed by Intel’s Stratix V family documentation, this device is appropriate for development teams and OEMs looking to consolidate complex digital functions into a single, RoHS‑compliant FPGA with clear, verifiable specifications.

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