5SGXMA4H2F35C2G

The 5SGXMA4H2F35C2G is a Stratix V GX family Field Programmable Gate Array (FPGA) IC from Intel, optimized for high-density digital designs. It delivers substantial core resources—420,000 logic elements and 158,500 LABs—combined with large on‑chip RAM to support complex logic, buffering, and algorithm acceleration.

With 600 I/O pins in a 1152‑BBGA FCBGA package and a compact 35×35 supplier package footprint, this commercial‑grade device targets applications that require high integration density, extensive I/O connectivity, and significant embedded memory within a surface‑mount form factor.

Key Features

• Core Density  420,000 logic elements and 158,500 LABs for large-scale digital integration and complex logic implementation.
• Embedded Memory  Approximately 38 Mbits of on‑chip RAM (37,888,000 bits) to support buffering, lookup tables, and local data storage.
• I/O Capacity  600 user I/Os to enable broad interfacing and high pin‑count system integration.
• Power Supply  Supported core voltage range from 870 mV to 930 mV for compatibility with specified power rails.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) optimized for surface‑mount PCB assembly and high‑density layouts.
• Operating Range & Compliance  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Network & Communications: High logic density and large embedded RAM support complex packet processing, protocol offload, and multiport interfacing where many I/Os and on‑chip memory are required.
• High‑Performance Computing Acceleration: Use for custom algorithm acceleration and hardware offload where extensive logic resources and local memory reduce external memory traffic.
• Signal Processing and DSP: Large logic element count and substantial on‑chip RAM enable implementation of real‑time signal chains, filtering, and buffering functions.
• Complex System Prototyping: A high I/O count and dense logic fabric make the device suitable for validating multi‑component systems and integration of custom IP blocks.

Unique Advantages

• High Integration Density: 420,000 logic elements and 158,500 LABs reduce the need for multiple devices, simplifying board design and lowering BOM.
• Significant On‑Chip RAM: Approximately 38 Mbits of embedded memory provides local storage for buffering and algorithm state without immediate reliance on external RAM.
• Extensive I/O Connectivity: 600 I/Os enable direct connections to numerous peripherals, transceivers, and system interfaces reducing the need for external multiplexing.
• Compact, Surface‑Mount Package: 1152‑BBGA (35×35 supplier package) supports dense PCB layouts while maintaining a standardized mounting approach.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation for standard commercial deployments.
• RoHS Compliant: Environmentally compliant for integration into modern manufacturing flows.

Why Choose 5SGXMA4H2F35C2G?

The 5SGXMA4H2F35C2G balances high logic capacity, substantial embedded memory, and broad I/O connectivity in a compact FCBGA package, making it suitable for complex digital designs that demand on‑chip resources and high pin counts. As a Stratix V GX device from Intel, it is positioned for engineers and procurement teams seeking a commercial‑grade FPGA with clear specifications for integration into high‑density systems.

This part is appropriate for development teams and system designers building network equipment, compute accelerators, signal processing platforms, and advanced prototypes that require scalable logic, local RAM, and extensive external interfacing while maintaining standard commercial operating conditions.

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