5SGXMA4H2F35C1N

The 5SGXMA4H2F35C1N is a Stratix V GX field‑programmable gate array (FPGA) in a 1152‑ball FCBGA package. It integrates 420,000 logic elements and approximately 38 Mbits of on‑chip RAM, providing a high‑density programmable fabric for complex digital designs.

Designed for commercial‑grade systems, this device suits applications that require large logic capacity, substantial embedded memory, and a high pin count, while operating from a low core supply of 0.87–0.93 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 420,000 logic elements for implementing large-scale digital designs and complex state machines.
• Embedded Memory — Approximately 38 Mbits of on‑chip RAM to support buffering, packet storage, and intermediate data processing without external memory in many use cases.
• I/O Density — 600 user I/O pins enabling extensive connectivity to peripherals, transceivers, and external logic.
• Transceiver Family Characteristics — As a Stratix V GX device, the family includes transceiver speed grades referenced in the device datasheet (GX channel speed grade options are documented within the Stratix V device datasheet).
• Power and Voltage — Core supply range of 870 mV to 930 mV, supporting low‑voltage core operation.
• Package — 1152‑BBGA FCBGA (35 × 35) supplier package for surface‑mount assembly and high I/O density.
• Operating Grade — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density logic integration — Implement complex state machines, protocol engines, and signal processing pipelines using the large logic element count and embedded RAM.
• Networking and connectivity — Support designs requiring many I/Os and programmable fabric for packet handling, bridging, or protocol adaptation.
• Data buffering and on‑chip storage — Leverage approximately 38 Mbits of embedded memory for FIFOs, frame buffers, and temporary data storage.
• Prototype and system integration — Use the FCBGA package and high pin count to integrate programmable logic into commercial‑grade systems that require dense routing and multiple external interfaces.

Unique Advantages

• High logic density: 420,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM complexity.
• Substantial embedded memory: Approximately 38 Mbits of on‑chip RAM minimizes dependence on external memory for many buffering and storage tasks.
• Large I/O complement: 600 I/Os provide flexibility to connect to multiple peripherals, high‑speed interfaces, and system-level interconnects.
• Low core voltage operation: Operates from 0.87 V to 0.93 V core supply, aligning with low‑voltage power domains in modern systems.
• Commercial temperature readiness: Rated for 0 °C to 85 °C operation to meet standard commercial electronic product requirements.
• RoHS compliant: Meets lead‑free and hazardous substance requirements for regulated markets.

Why Choose 5SGXMA4H2F35C1N?

This Stratix V GX FPGA delivers significant on‑chip resources—420,000 logic elements, approximately 38 Mbits of RAM, and 600 I/Os—packaged in a 1152‑BBGA FCBGA footprint. It is positioned for commercial systems that need high integration density, substantial embedded memory, and a broad I/O complement while operating within standard commercial temperature and low core voltage domains.

Engineers targeting complex digital processing, data buffering, or multi‑interface integration will find the device’s resource mix and package suitable for consolidating functionality and simplifying board-level design. The device benefits from family-level documentation and device electrical characteristics detailed in the Stratix V datasheet.

If you would like pricing, availability, or a formal quote for 5SGXMA4H2F35C1N, submit an inquiry or request a quote from our sales team.