5SGXMA4H1F35I2N

The 5SGXMA4H1F35I2N is an Intel Stratix® V GX field‑programmable gate array (FPGA) supplied in a 1152‑ball FCBGA package. It delivers a high logic capacity, large embedded memory, and a high‑density I/O complement for complex system integration in industrial‑grade environments.

As a member of the Stratix V GX family, the series documentation notes GX transceiver speed grades up to 14.1 Gbps. This device’s combination of logic resources, I/O count, and industrial temperature rating supports demanding embedded and system applications that require high integration and robust operation.

Key Features

• Logic Capacity — 420,000 logic elements to implement large, complex designs and high‑density custom logic.
• Embedded Memory — Approximately 37.9 Mbits of on‑chip RAM for buffering, FIFO, and local storage needs.
• I/O Density — 600 I/O pins to support broad peripheral connectivity and system interfacing.
• Package & Mounting — 1152‑BBGA, FCBGA (supplier device package: 1152‑FBGA, 35×35) in a surface‑mount format for compact board integration.
• Power Range — Voltage supply range of 870 mV to 930 mV for core operation.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for harsh thermal environments.
• Compliance — RoHS compliant.

Typical Applications

• High‑density system integration — Use where large numbers of logic elements and embedded memory are required to consolidate multi‑function systems onto a single FPGA.
• High‑I/O interface hubs — Ideal for designs that require extensive external connectivity thanks to 600 available I/O pins.
• Industrial equipment — Suited to industrial applications that demand wide operating temperature capability and robust packaging.

Unique Advantages

• Substantial logic resources — 420,000 logic elements enable implementation of complex datapaths, control logic, and acceleration functions on a single device, reducing system partitioning.
• Significant embedded memory — Approximately 37.9 Mbits of on‑chip RAM reduces dependency on external memory for buffering and local storage.
• Extensive I/O — 600 I/O pins provide flexibility for interfacing with high‑pin‑count peripherals and multiple I/O standards (per family capabilities).
• Industrial temperature rating — −40 °C to 100 °C operation supports deployment in thermally demanding environments.
• Compact, board‑level package — 1152‑ball FCBGA footprint (35×35) delivers a dense solution for space‑constrained PCBs.
• RoHS compliant — Meets material compliance expectations for many industrial and commercial programs.

Why Choose 5SGXMA4H1F35I2N?

The 5SGXMA4H1F35I2N positions itself as a high‑capacity Stratix V GX FPGA tailored for designs that require substantial logic and memory resources, broad I/O capability, and industrial temperature operation. Its combination of 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and 600 I/Os makes it a strong candidate for consolidating multiple functions into a single programmable device.

Engineers and procurement teams looking for a scalable, robust FPGA solution will find this device aligns with long‑lived system designs where integration density, thermal range, and compliance are prioritized.

Request a quote or submit an inquiry to evaluate 5SGXMA4H1F35I2N for your next design and obtain pricing, lead time, and availability information.