5SGXMA4H1F35C2N

The 5SGXMA4H1F35C2N is a Stratix V GX family FPGA from Intel, offered as a commercial-grade, surface-mount FCBGA device. It provides a high logic capacity and extensive I/O connectivity for complex, high-density FPGA designs.

With 420,000 logic elements and approximately 38 Mbits of on-chip RAM, this device is intended for designs that require large programmable logic and embedded memory within a compact 1152-BBGA (35 × 35 mm) package.

Key Features

• Logic Capacity  420,000 logic elements to implement large-scale custom logic and state machines.
• Logic Blocks  158,500 logic blocks (reported in device data) supporting hierarchical and partitioned designs.
• Embedded Memory  Approximately 38 Mbits of total on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Density & Package  600 general-purpose I/Os housed in a 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35 × 35 mm), optimized for high-pin-count board designs.
• Power and Supply  Core voltage supply range specified at 870 mV to 930 mV for the device core.
• Mounting & Thermal  Surface-mount FCBGA package; commercial operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Series Documentation  Part of the Stratix V GX family; series documentation describes electrical and switching characteristics, I/O timing, and available speed grades for Stratix V devices.

Typical Applications

• High-density digital processing  Large logic capacity and substantial on-chip RAM support complex signal processing and algorithmic acceleration within a single FPGA.
• Multi-channel I/O systems  600 I/Os and the 1152-BBGA package enable designs that require extensive external device interfacing and parallel data paths.
• Embedded memory-dependent designs  Approximately 38 Mbits of embedded RAM provide local storage for buffering, packet handling, and real-time data manipulation.

Unique Advantages

• High programmable capacity: 420,000 logic elements allow implementation of large, integrated functions on a single device, reducing board-level complexity.
• Significant on-chip RAM: Approximately 38 Mbits of embedded memory reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O reach: 600 I/Os accommodate high-channel-count designs and complex peripheral connectivity without multiple devices.
• Compact, high-pin package: 1152-BBGA (35 × 35 mm) supplier package balances pin density and board area for space-constrained applications.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation for designs targeting commercial environments.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXMA4H1F35C2N?

The 5SGXMA4H1F35C2N combines high logic density, substantial embedded memory, and robust I/O capability in a single Stratix V GX FCBGA package. It is suited for designers who need to consolidate complex digital functions, extensive parallel interfaces, and memory-dependent logic into a compact commercial-grade FPGA solution.

Backed by Intel's Stratix V GX family documentation, the device offers a verifiable set of electrical and switching characteristics and is appropriate for developers focused on scalable, high-capacity FPGA implementations within the specified voltage and temperature ranges.

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