5SGXMA4H1F35C1WN

The 5SGXMA4H1F35C1WN is a Stratix V GX field programmable gate array designed to deliver high programmable logic capacity and substantial embedded memory in a single device. It integrates 420,000 logic elements and approximately 37.9 Mbits of on-chip RAM, with a 600-pin I/O count to support complex, I/O‑dense designs.

Packaged in a 1152‑FBGA (35×35) FCBGA surface‑mount package and specified for commercial temperature operation (0 °C to 85 °C), this device is aimed at systems that require large programmable resources and a compact high‑pin package while operating at a low core voltage (870 mV to 930 mV).

Key Features

• Logic Capacity 420,000 logic elements to support large-scale programmable logic implementations and complex digital designs.
• Embedded Memory Approximately 37.9 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑intensive functions.
• I/O Density 600 I/Os provide extensive external connectivity for high‑channel or multi‑interface applications.
• Power Domain Core supply specified at 870 mV to 930 mV to match low‑voltage system architectures.
• Package & Mounting 1152‑FBGA (35×35) FCBGA package in a surface‑mount format for compact board integration.
• Commercial Temperature Grade Operating temperature range 0 °C to 85 °C for commercial applications.
• Standards Compliance RoHS compliant to support environmentally regulated designs.

Typical Applications

• High-density digital processing — Use the large logic count and embedded RAM to implement complex signal processing, packet processing, or custom compute engines.
• I/O-intensive systems — Leverage 600 I/Os for multi‑channel interfaces, large sensor arrays, or multi‑lane communications front ends.
• Embedded system integration — Combine programmable logic and on-chip memory in a single FCBGA package to reduce board area for compact designs.

Unique Advantages

• Substantial programmable capacity: 420,000 logic elements provide headroom for large FPGA designs and complex IP integration.
• Significant on-chip memory: Approximately 37.9 Mbits of RAM reduces dependence on external memory for many buffering and storage tasks.
• High external connectivity: 600 I/Os enable extensive peripheral and high‑channel connectivity without additional interface chips.
• Compact FCBGA package: 1152‑FBGA (35×35) allows high pin count in a surface‑mount form factor suitable for dense PCB layouts.
• Low-voltage core operation: Core supply range (870 mV–930 mV) aligns with low‑voltage programmable logic power domains.
• RoHS compliant: Meets RoHS environmental requirements for regulated deployments.

Why Choose 5SGXMA4H1F35C1WN?

The 5SGXMA4H1F35C1WN combines high logic density, substantial embedded RAM, and a 600‑I/O count in a compact 1152‑FBGA surface‑mount package, suited for commercial temperature designs that require large programmable resources and high external connectivity. Its specified core voltage range and RoHS compliance help integrate the device into modern, environmentally regulated system designs.

This Stratix V GX device is appropriate for teams and projects that need significant on-chip resources in a single FPGA package and want a component backed by a documented device family datasheet for electrical and timing characteristics.

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