5SGXMA4H1F35C1G

The 5SGXMA4H1F35C1G is a Stratix V GX family FPGA delivered in a 1152-FBGA (35×35) surface-mount package. It provides a high-density programmable fabric with substantial embedded RAM and a large I/O count for complex digital system integration.

Designed as a commercial-grade device (0 °C to 85 °C) with RoHS compliance, this FPGA is suited for designs that require significant logic capacity, abundant on-chip memory, and many user I/O signals while operating from a low core supply of 870 mV to 930 mV.

Key Features

• Core Logic  Approximately 420,000 logic elements to implement complex state machines, datapaths, and custom processing pipelines.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM for buffering, FIFOs, and LUT-based storage.
• High I/O Count  600 user I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Power/Core Supply  Core operating range from 870 mV to 930 mV to match low-voltage system designs.
• Package and Mounting  1152-FBGA (35×35) surface-mount package (1152-BBGA, FCBGA package case) for high-density board layouts.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial applications.
• Transceiver and Switching Characteristics  Part of the Stratix V GX family with device datasheet coverage for electrical and switching characteristics, including transceiver specifications and I/O timing.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High‑density digital processing  Leverages ~420,000 logic elements and ~38 Mbits of on-chip RAM for complex signal processing, custom accelerators, and stateful datapaths.
• Multi‑lane I/O systems  Supports designs requiring many parallel interfaces or multiple peripheral buses with 600 user I/Os.
• Protocol bridging and aggregation  Large logic capacity and embedded memory enable protocol conversion, packet aggregation, and buffering functions in commercial equipment.

Unique Advantages

• High integration density: The combination of hundreds of thousands of logic elements and large embedded RAM reduces external component count for complex designs.
• Extensive I/O capability: 600 I/Os provide flexibility to connect numerous peripherals, busses, and board-level interfaces without immediate need for GPIO expanders.
• Compact, production-ready package: 1152-FBGA (35×35) packaging enables high-density PCB routing and reliable surface-mount assembly.
• Commercial temperature qualification: Rated 0 °C to 85 °C to match a wide range of commercial environments and applications.
• Regulatory alignment: RoHS compliance supports environmentally driven procurement and manufacturing processes.

Why Choose 5SGXMA4H1F35C1G?

5SGXMA4H1F35C1G positions itself as a high-capacity Stratix V GX FPGA option for commercial designs that demand significant programmable logic, substantial embedded memory, and abundant I/O. Its FBGA packaging and RoHS compliance make it suitable for compact, production-oriented board designs operating within commercial temperature ranges.

Engineers building complex digital signal processing, protocol handling, or multi-interface systems will find this device delivers the integration needed to reduce external components and simplify system architecture while relying on the Stratix V series’ documented electrical and switching characteristics.

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